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The Global Assembly Journal for SMT and Advanced Packaging Professionals
Volume 9 Number 9 September 2009 ISSN 1474 - 0893
The Global Assembly Journal for SMT and Advanced Packaging Professionals
Volume 9 Number 10 October 2009 ISSN 1474 - 0893
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POP (PACKAGE ON PACKAGE) AND VAPOR PHASE TECHNOLOGY
A BASELINE STUDY OF STENCIL AND SCREEN PRINT PROCESSES FOR WAFER BACKSIDE COATING
FATIGUE & CREEP WEAROUT IN ELECTRONICS: A HISTORICAL RETROSPECTIVE
SPECIAL PACKAGING FEATURE:
Imbedded Component/Die Technology (IC/DT®): Is it ready for mainstream design applications?
Plus: IC packaging and interconnection technologies’ 4th dimension challenge
Mike Nelson Interview Inside
NEW PRODUCTS INDUSTRY NEWS
INTERNATIONAL DIARY
WHAT YOU NEED TO KNOW BEFORE BUYING YOUR AOI SOLUTION
WHICH TOOLS ARE BEST FOR SMT REWORK— CONDUCTION OR CONVECTION?
BUSINESS PROCESS MANAGEMENT FOR IMPROVED PRODUCTIVITY AND CUSTOMER SATISFACTION
Mike Scimeca Interview Inside
NEW PRODUCTS INDUSTRY NEWS
INTERNATIONAL DIARY
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GSP9.11
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