5D solder paste inspection—merits beyond 3D technology
time and running several boards aſter each change, the system enables the process engineer to readily gauge if the new setting provides increased or reduced stabil- ity.
A further improvement
can be made if SPI and AOI data is merged to analyze if a defect found by AOI has its origin in the printing pro- cess or to readjust AOI tol- erances upon inspection of certain solder joints.
5D SPI, an improvement
in ROI With the introduction of 5D SPI, all categories of print process errors can be reli- ably identified and man- aged. Tree dimensions (X, Y, Z) are needed to cover the wide range of printing defects, all printing process errors.
Two Dimensions
(X and Y) are needed to cover errors linked to area, offset, smearing and bridg- ing. Te third dimension (Z) is required to identify errors related to height and volume. Combining the best techniques to identify errors in each axis clearly improves the ROI for SPI equipment, and enables a next genera-
tion of closed loop process control. Te Marantz
PowerSpector S1 employs the new “5D”
technology
to deliver true area, shape, offset, volume and height measurement in one cycle for the first time. Tis high speed post-
print solder paste inspec- tion system incorporates patented new sensor tech- nology and simultaneously combines 3D and 2D image processing methodologies for enhanced defect detec- tion and process control. Intercepting
these
defects before they happen reduces rework costs, pro- vides instant yield improve- ment and accelerates return on investment. Te enhanced process control empowered by 5D technol- ogy provides the perfect solder paste printer adjust- ment tool, enabling the cor- rection of printer settings or paste problems before a problem spreads across an entire product.
Figure 10. Integrated SPI deployment offers significant opportunity for permanent yield improvement and reduced cost to manufacture.
www.globalsmt.net
Global SMT & Packaging – February 2011 – 13
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80