Counterfeit components—EU project launched
Counterfeit
components—EU project launched
Bob Willis
Figure 1. Examples of counterfeit components found during failure analysis of products. S
MART Group is a member of ChipCheck, a European-funded proj- ect looking at the problems associated
with counterfeit components and a practi- cal solution for the electronics industry. Tis project continues the Group’s activ- ity on counterfeit components aſter run- ning many successful workshops on the practical aspects of testing components. ChipCheck is coordinated and managed by TWI. Te research leading to these results has received funding from the European Community’s Seventh Framework Programme managed by REA-Research Executive Agency ([FP7/2007-2013] under grant agreement no 262212. Counterfeit electronic components
are defined as substitutes or unauthor- ised copies of a product, a product used in which materials used or the performance of the product has changed without notice, or
4 – Global SMT & Packaging – February 2011
a substandard component misrepresented by the supplier. Counterfeit electronic components are a growing issue to the elec- tronics industry. Te consequential costs to electronics manufacturers of inadver- tently purchasing counterfeit components includes lost yield, field failures, product recalls and damage to reputation, etc. Tis is not to mention the safety issue. Despite extra precautions taken for sourcing com- ponents for safety critical electronic sys- tems, there have been reports of counterfeit components entering the supply chains for both the defence and aerospace industry. Currently, manufacturers cannot check
all components at goods inwards even if they wanted to, due to the volume, the pro- tective packaging and oſten the manpower required. Te new EU FP7-part-funded project ChipCheck seeks to address this with the development of a new inspection
The ChipCheck consortium is developing a new system to detect counterfeit components. To help test the system, we require as many counterfeit electronic components as possible.
Ideally, these compo-
nents will be unused, but they could be parts removed from an assembly. We are interested in receiving all package types and sizes to make sure the system and soſtware recognition is capable of comparing the range of parts used in industry. Te main focus will be surface mount; how- ever, dual in-line parts will also be assessed. Te source of the compo- nent will be kept completely anony- mous. We’ll even consider purchas- ing counterfeit components if there are any for sale.
www.globalsmt.net
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