IMAPS Europe News Title IMAPS Europe News
A letter from IMAPS North America Te “I” is definitely back in IMAPS with a considerable amount of interaction between US and European/Asian Chapters. Let us continue the work to bring the electronics packaging community around the world closer. First, we would like to extend our appreciation to the many International attendees
at our recent IMAPS Symposium in Raleigh, North Carolina. Your support helped make this event a success. Each year, IMAPS presents awards to several members for their significant con- tribution to the society and the technical community.
In 2010 I am very pleased to
report that many of the awards were presented to extremely worthy individuals from Europe. Nihal Sinnadurai received the President’s Award for his creative diplomacy in establishing cordial and professional relations between the North American and European chapters of IMAPS, and contribution to a common platform for One World Membership (OWM). Karel Kurzweil received the Daniel C. Hughes award for his long term support of IMAPS and his involvement in the development of thick film- based multichip modules with TAB chip assembly and its introduction into high volume manufacturing; and for his development of smart card assembly including chip embedding. Paul Collander received the 2010 Sidney J Stein International Award for his continued leadership in ISHM/IMAPS Nordic since 1974 and his tireless work for IMAPS Europe - serving in many roles And now Past President of IMAPS Europe, supporting IMAPS-India EMIT, and his leadership role of IMAPS-Nordic. Barbara Dziurdia became a 2010 Fellow of IMAPS for her contributions to IMAPS as Treasurer of IMAPS Poland; as Treasurer of the European Microelectronics Packaging & Interconnection Symposium; and as a member of the Steering Committee of local technical conferences and European symposia. Additionally, in 2009, the William D. Ashman Award was presented to Dr. Peter Ramm for his pioneering work in 3D thru- silicon-via (TSV) technology development. Congratulations to all of them and thank you for their support of IMAPS. IMAPS’ mantra has always been to produce the best technical programmes in the
microelectronics industry. Our technologies and business are global and international collaborations in events are invaluable. 2011 will be no different and I hope to see you at several of these events as presenters, organizers or attendees. Some of the events are listed below and several other events are in the planning stages and they will be posted shortly on the website
www.imaps.org. Printed System Level Packaging 2011, 23-24 Feb; Device Packaging 2011, 7-10
Mar; Packaging Solar Cells and Fuel Cells, 29-30 Mar; IMAPS/ACerS CICMT 2011, 5-7 April; High Temperature Network (HiTEN) 2011, 18-20 July; RF/Microwave 2011, 20-22 Sept; IMAPS 2011 Symposium in Long Beach, 9-13 October. I urge you to participate in the IMAPS-Europe EMPC-2011 Conference to be held
in Brighton, England 12th-15th September 2011. All details are available at www.
EMPC2011.com ‘
Warm Regards, Rajen Chanchani
President, IMAPS North America
6th European Advanced Workshop on MicroPackaging and Thermal Management For the sixth consecutive year, IMAPS- France organizes the “European Advanced Technology Workshop on MicroPackaging and Termal Management” in La Rochelle on February 2nd and 3rd, 2011. Addressed
www.globalsmt.net
topics this year include: • Chip-level, board-level and system- level thermal management
• Package platforms and architectures for power semiconductors
• Termal modelling and simulation • Heatsinks, heatpipes and other cool- ing products
• Liquid and phase change cooling • New cooling solutions • Termal management of opto-elec- tronic components
Presenting companies France,
originate from the USA, Germany, Austria,
Switzerland, Belgium and Spain. Alongside the conference, a table top
exhibition will be held. Do not miss this opportunity to meet
with the European and international com- munity of thermal management of elec- tronic systems! Please download the conference pro-
gramme from
www.imapsfrance.org. For more information, and to register,
please contact Florence Vireton 33 ( 0)1 39 67 17 73 or email
imaps.france@imaps-
france.org.
MiNaPAD 2011 MiNaPAD,
the Micro/Nano-Electronics
Packaging & Assembly, Design and Manufacturing Forum, will be held in Grenoble, on the new Minatec campus, on May 11 & 12. MiNaPAD is a 2-day confer- ence with an exhibition. Addressed topics include: • Design: CAD and design techniques, IO placement for advanced packaging (fan-out, 3D packaging), design for reliability, IC and package co-design, RF package design,
thermal and
mechanical predictability (models and simulations)
• •
Innovative packaging for MEMS and emerging applications: photovoltaic, biosensors,
energy scavenging and
batteries, high brightness LEDs,… automotive and medical
applications: solving test and reliabil- ity challenges
• Process, test, reliability, character- ization and challenges of advanced packaging platforms: 3D Packaging (with or w/o TSVs), fan-out WLP and embedded IC package.
• Advanced interconnections: flip-chip for high IO count devices and sub 45nm CMOS, new flip-chip and WLP metallurgies, bumping techniques
For more information, please contact Florence Vireton: 33 ( 0)1 39 67 17 73 or email
imaps.france@
imapsfrance.org.
Global SMT & Packaging – February 2011 – 73
System-in-Package for smart systems, telecom,
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