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New products New products
VIGON® UC 160 for stencil underside wiping in printers ZESTRON has introduced the water-based cleaning agent VIGON® UC 160 for stencil underside wiping in printers. As a water- based cleaning agent, VIGON® UC 160 is specifically designed to remove solder paste from stencils in SMT printers. VIGON® UC 160 is an ideal replacement for Isopropanol thanks to health and safety characteristics such as no flashpoint and low VOC value.
www.zestron.com
Christopher Associates debuts Koki SB6N58-A730 low-temperature lead-free solder paste Christopher Associates has introduced Koki’s SB6N58-A730 low temperature lead-free solder paste. SB6N58-A730 paste has a melting point of 201-210˚C. Koki conducted an extensive investigation with multiple indium alloys, learning that struc- tural transformation and thermal shock characteristics can be directly controlled with measured additions of indium. Koki’s new SB6N58-A730 low temperature lead- free paste with six percent indium pro- vides less transformation within the alloy composition and a lower melting point.
www.christopherweb.com
blies with excellent cosmetics with a uni- form, tack-free residue and pin testabil- ity. ALPHA® EF- 6850HF flux also offers excellent low bridging and low solder ball results.
www.alpha.cooksonelectronics.com
Techcon Systems introduces manual plungers and piston for 700 Series syringe barrels Techcon Systems introduced new manual plungers and pistons for the 700 Series Syringe Barrels. Te new assemblies pro- vide dispensing solutions without the need for compressed air. Te plung- ers and pistons are available in 4 sizes: 3 cc, 5 cc, 10 cc, 30 cc and are conve- niently packaged in boxes of 50 pieces.
www.techconsystems.com
Acculogic’s FLS980Dxi Flying Scorpion™ nominated for 2011 Best in Test award Acculogic, Inc. has been nominated for a 2011 Best in Test Award in the cat- egory of ATE/Production Test for its FLS980Dxi Flying Scorpion™. FLS980Dxi Flying Scorpion™ is the only patented double-sided, multi-probe (22) flying probe system with 3-D probing, analog, digital and boundary scan test capabil- ity on all probes (top- and bottom-side).
www.acculogic.com
Thermally conductive epoxy delivers high temperature resistance & outstanding electrical insulation Master Bond has developed a highly ther- mally conductive epoxy system designed to help mitigate the issues associated with tightly packed components and miniatur- ized electronic circuits. With a thermal con- ductivity over 22 BTU/in/ſt²/hr/˚F and ser- viceability from -60 to 400° F, Master Bond EP21ANHT delivers outstanding perfor- mance in the most demanding microelec- tronic applications. EP21ANHT is avail- able in pint, quart, gallon and 5 gallon kits.
www.masterbond.com
Alpha announces the global launch of ALPHA® EF-6850HF halogen-free liquid soldering flux Alpha announces the global launch of ALPHA® EF-6850HF liquid soldering flux. Tis new halogen-free, low solids, alcohol- based, no-clean flux was formulated for use in Sn-Pb and Pb-free applications on both standard and thicker, high-density PCBs. ALPHA® EF-6850HF is environmentally friendly and complies with halogen-free industry standards.
Its unique activator package produces highly reliable assem- 68 – Global SMT & Packaging – February 2011
www.globalsmt.net
Pillarhouse offering new options on the popular Jade MKII selective machine Pillarhouse USA Inc is proud to announce new available options on the the Jade MKII selec- tive soldering platform. With Pi l larhouses’s newest Universal Soſtware stan- dard new fea- tures will be available on all Pill a r h o u s e’s newest equip- ment lines - which includes the Handex and Synchrodex machines, as well as the Jade MKII.
www.pillarhouseltd.com
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