New products
PackageOnPackage.co.uk
Package on Package (PoP) education & process support when or wherever you want it
Online Training Hands On Training Process Consultancy Inspection Posters Interactive CD-ROM Photo Album CD-ROM
One provider with many different solutions.….….
PackageOnPackage.co.uk
3 years DIMA Financial Services 19 years DIMA Special Products
22 years DIMA Dispense Technology 25 years DIMA SMT Systems
69 years DIMA Group experience
1986 - 2011
www.dimagrp.com
silicone encapsulant. Designed for encap- sulation applications where high heat dis- sipation is required, LORD SC-305 is a two- component silicone system. LORD SC-305 also meets the requirements of UL 94 V-O, providing excellent flame retardancy. Te three-step application process involv- ing mixing, applying and curing is user- friendly, making LORD SC-305 an ideal solution for encapsulation.
www.lord.com
Practical Components offers Amkor TMV® PoP (Package on Package) daisy chain components
of the TMV® is identical to the live pack- age without the expensive IC die inside. Te dummy versions are made of the same materials on the same manufacturing lines and have the same size, thermal and sol- dering properties as the live equivalent.
www.practicalcomponents.com
Fancort introduces small force servopress with heater plates Fancort
introduces a programmable ser-
vopress with three easily interchangeable actuators with different force ranges: one from .2 to 20 kgf, the second from .4 to 40 kgf and the last from .6 to 60 kgf. Fancort’s servopress includes a teach pendant and soſtware for operating the press, and a simple control box for setting temperatures on the heater plates.
www.fancort.com
same time, but can also accommodate levels that differ by up to 3 mm.
www.dek.com
LORD Corporation develops thermally conductive silicone encapsulant LORD Corporation has announced the availability of a new thermally conductive
www.globalsmt.net Practical Components Inc. announces
the availability of daisy chain samples of Amkor Technology, Inc.’s TMV® PoP (package on package) solution. Te Practical Dummy Component® version
Global SMT & Packaging – February 2011 – 71
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