Title
Association & Institutes News Association & Institutes News
conformal coating applications, properties of lead-free alloys and land grid array/quad flat no-lead design and assembly. Suppliers can gain new visibility in
EIPC Winter Conference—Cologne, Germany, February 3rd & 4th 2011 Te European Institute of Printed Circuits (EIPC) has announced that their Winter Conference will take place at the Hotel Mondial am Dom in Köln, Germany, on Tursday, February 3rd and Friday, February 4th 2011. Day One is an exciting blend of theory
and practice—EIPC has arranged a visit to the factory of ISOLA GmbH and CCI Eurolam in Düren in the aſternoon, with the keynote session of the conference being delivered in the morning by Ray Sharpe, CEO of the ISOLA Group. Other topical matters for presentation and discussion will include the business outlook from Walt Custer, a look at power electronics by Hans Friedrichkreit,
lean manufacturing from
the rising UK company Spirit Circuits and power pricing by Simon Kücher & Partners. Albemarle and Multilayer Technology GmbH & Co. KG will discuss the latest position with flame retardants and UL approvals respectively. Day Two will see a wide variety of from illustrious
speakers companies
such as Ohmega Technologies Inc., CIRE Group, Gebr. Schmid GmbH Co., Rhode & Schwarz GmbH & Co. KG, DuPont Circuit & Packaging Materials, Arlon MED etc., who will look at embedded component technology, advanced processing technol- ogy and reliability issues, and there is to be a fascinating paper on the use of ultrasound for low temperature plating from Dr. Andy Cobley of the Te Sonochemistry Centre at Coventry University in the UK. Te day will conclude with a second but important look at UL the new challenges & solutions by UL and the status of the industry. EIPC conferences have a reputation
for providing a confluence of business and social activities to a high standard, and the event on Cologne next February will be no exception. To register, contact Ms. Sonja Derhaag at the EIPC offices sderhaag@
eipc.org.
www.eipc.org
IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest offers critical information Eastern Europe’s growing electronics assembly industry faces new challenges, especially with the adoption of technology.
lead-free To connect manufactur-
ers with solutions to these challenges, IPC—Association Connecting Electronics Industries® is holding the IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest, Hungary, on 22–24 February 2011. Cosponsored by the Hungarian
Electronics Association, the event offers workshops, a two-day conference and table- top exhibits. Conference topics include: • Te Importance of IPC Standards in Quality and Reliability
• State of the Hungarian Electronics Industry
• Environmental Regulations Impacting PCBs and Electronics Assembly
• Te Effect of Moisture Levels in Laminates During Lead-Free Processing
• Design of Printed Circuit Boards for Reliable High Speed Signal Transmission
• Common Solder Joint Problems During Live Production at S.E.E. 2010
• Fighting Tin Whiskers - Causes and Solutions
• Minimizing Defects in the Assembly Process Including “Head on Pillow”
• Integrating Cleaning Equipment and Cleaning Agent for Maximum Performance
• Acceptability Requirements for Rework and Repair
Preceding the conference, half-day work- shops will be held on 22 February by electronics manufacturing experts Bob Willis, Lars Wallin and Lars-Gunnar Klang. Workshop topics include the use of IPC standards in the manufacturing process,
72 – Global SMT & Packaging – February 2011
Eastern European by signing up as gold or silver sponsors. For more information or to register,
visit
www.ipc.org/Budapest-Conference. For details on event sponsorship, contact Maria Labriola, IPC manager of trade show sales, at +1 847-597-2866 or MariaLabriola@ipc. org or Lars Wallin, IPC European represen- tative, at +46 8 26 10 07 or LarsWallin@ipc. org.
IPC and ENVIRON launch webinar on RoHS2 compliance Following European Parliament agree- ment of the final text of the new RoHS Directive on November 24, ENVIRON and IPC—Association Connecting Electronics Industries® present an exclusive webinar to provide essential information on the new compliance requirements for manufactur- ers, importers and distributors. Te RoHS Directive Recast Webinar will be held Tursday, December 16, 10:00 am to 11:00 am U.S. Central time (4:00 pm to 5:00 pm Central European time). Te new RoHS Directive will become
EU law as soon as translations into the 22 official EU languages are completed in Q2 2011. All EU Member States’ RoHS Regulations will then be amended, and sales of new electrical and electronic equip- ment will be required to comply within 18 months. Te RoHS Directive Recast Webinar
will explain the impact of the new require- ments including: • Timelines for implementation • Substances for priority assessment • Open scope • New exemptions policy • New compliance responsibilities for manufacturers, importers and distributors
• Product CE marking requirements
Registration and further details about the webinar are available at
www.ipc.org/ ehs-webinars.
www.globalsmt.net
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