Presenting the 6th annual Global Technology Awards
Pick & Place Equipment—Low to Medium Volume JX-100 LED for LED manufacturing from Juki Juki is proud to introduce the JX-100LED, an enhanced JX-100 designed to be able to support a 31.5” x 14” board size when indexed twice in the machine targeted specifically for LED manufacturing. With speed in mind, the JX-100LED can place 15,300 chips per hour at IPC 9850 and can support placement of parts from 01005 to 33.5mm squared. Te JX-100LED also features an optional tri-colored vision centering system that can be used for placing fine pitch QFPs, BGAs and QFNs for added flexibility and accuracy.
www.jas-smt.com
Pick & Place Equipment—High Volume FX2 High Speed Modular Mounter from Juki Te FX-2 is Juki’s latest high-speed modular mounter with production capacity increased by 20 percent over previous models, improved economical efficiency, operations, and reliability. Te new 2 head, 12 nozzle design offers a placement speed of 30,000 CPH, an increase of 20 percent over its predecessor. . Te FX-2 uses the same nozzles, feeders and production data as other Juki mounters providing better use of assets and simpler operations on the production floor.
www.jas-smt.com
Printing Equipment UltraSlic™ FG laser-cut stencil from Fine Line Stencil Te UltraSlic™ FG stencil is the first laser-cut, solder paste stencil that has paste release performance comparable to electroform technology, yet can be cut and shipped the same day the order is placed. Te UltraSlic™ FG stencil incorporates the latest advancements in stencil laser technology along with a new, cutting edge Fine Grain stencil material from Datum Alloys. Superior print performance is achieved at surface area ratios as low as 0.45.
www.finelinestencil.com
Programming 2800 concurrent programming system from BPM Microsystems Model 2800 combines BPM’s award-winning, proven Flashstream technology with universal device support, resulting in the fastest universal device programmer. It uses 64-bit architecture, which pushes device programming beyond the 4 GB data density barrier. Te 2800 was designed to support very low voltage devices down to 0.7 (Vdd). It also uses BPM’s innovative individual socket cards as opposed to “gang” cards, which are soldered to a common PCB.
www.bpmmicro.com
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Selective Soldering Equipment Jade Handex selective soldering system from Pillarhouse Designed for lean manufacturing environments, the Jade Handex standalone selective soldering system offers the rapid throughput of an in-line system together with the flexibility of a manual machine. Te Jade Handex has interchangeable lead-free and tin-lead solder pots and can be converted from a standalone to an in-line system at the customer’s site when additional throughput is needed.
www.pillarhouseltd.com
Software Materials Manager from Mentor Graphics, Valor Division Te Materials Manager application is based on actual materials usage, both consumption and attrition (i.e. dropped parts/mispicks) from the SMT machines in the factory to generate true “Lean” pull signals for replenishment materials and replacement materials needed to complete the work order ahead of a planned change over. Tis is an intelligent system that makes the best decisions possible to ensure the correct material is delivered with the lowest “cost” of operation to the correct machines, just in time.
www.mentor.com
46 – Global SMT & Packaging – February 2011
www.globalsmt.net
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