Front End I News
Rutronik and Toshiba expand distribution agreement
Toshiba Electronics Europe and Rutronik Elektronische Bauelemente GmbH have expanded their pan- European distribution agreement to the entire Toshiba Semiconductor and Storage portfolio. Embedded NAND flash memory, discrete semiconductors and system LSI as well as Bluetooth and TransferJet solutions from Toshiba will be added to the Rutronik distribution portfolio. Toshiba and Rutronik have been partners in the Storage Products field for many years. Due to the success of the cooperation, the two companies are now extending their agreement. "We are delighted that Rutronik now represents our entire portfolio,” explains Klaus Michel, General Manager at Toshiba. "Rutronik’s high levels of technical and commercial support as well as logistical expertise make this partnership beneficial for both parties and are of particular benefit to our customers." A key focus is on Toshiba’s leading range of embedded NAND flash memory products that includes SLC NAND, BENAND and e•MMC. These embedded memory products are ideal for a wide range of applications in security, networking, consumer goods and in the audio and video signal processing. "The wide range of NAND Flash memory from the market and innovation leader Toshiba closes a gap in the Rutronik portfolio with industry-leading and highly reliable products," explains Thomas Ulinski, Marketing Director Semiconductors at Rutronik. "In the optoelectronics segment, high- speed optocouplers from Toshiba provide an important performance enhancement and provide Rutronik customers with interesting components in the lower, middle and upper performance segment," said Ulinski. The Toshiba high-speed optocouplers enable faster data transmission, electrical isolation and data synchronization in ultra fast networks. Toshiba’s discrete semiconductors and MOSFETs portfolio comprises high and low
New roles for two key staff members at Knowles Capacitors
Klaus Michel (left), GM at Toshiba Electronics Europe shakes hands with Thomas Ulinski (right), Marketing Director Semiconductors at Rutronik
voltage products with an excellent price- performance ratio. In the small signal and logic ICs Toshiba offers a very wide range of products in the standard segment. These are complemented by market- leading Single Gate Logic ICs and a wide selection of analogue ICs. Rutronik’s Wireless Competence Centre will also benefit from the enhanced cooperation, as Bernd Hantsche, Marketing Director Embedded & Wireless, elaborates: "For many years we have successfully distributed wireless modules based on Toshiba chips, and know their excellent performance. Now we can offer our customers wireless chips using the same technology and provide direct access to support from Toshiba’s technical experts. Toshiba was one of the first providers of ICs with support for Bluetooth 4.0 Dual Mode (SPP and GATT) and their leading edge experience will be of benefit to our customers. Brand new to the Rutronik portfolio will be Toshiba’s TransferJet solutions that provide fast data transfer outside the usual ISM bands and we expect these to be of great interest to our customers,” Hantsche concludes.
TT Electronics acquires Aero Stanrew Group
TT Electronics has announced the acquisition of Aero Stanrew Group Limited. The acquisition will enable TT Electronics to provide a wider range of solutions to customers in the aerospace and defence sectors. Aero Stanrew, headquartered in
Barnstaple, Devon, is a leader in the design and production of electromagnetic components and electronic systems for harsh environments and safety critical applications. The business is primarily focused on the commercial aerospace and defence markets with sole-source positions on key growing platforms. They solve complex technical challenges in product areas and for a customer base which overlaps with a number of TT’s businesses. The combination of TT and Aero Stanrew
6 December 2015/January 2016
provides the opportunity to accelerate TT’s strategy to offer a wider range of capabilities to a broader base of tier one customers and increase exposure to aerospace and defence, one of TT’s core markets. Aero Stanrew has a well- established position in the market and, with access to TT’s global networks and expertise, they can increase the scope of future offerings into their existing customer base.
Commenting on the acquisition,
Richard Tyson, Chief Executive said, “We have a clear goal to return to sustainable, profitable growth. The acquisition of Aero Stanrew accelerates our strategy and strengthens our position in growth areas of the aerospace and defence market, enhancing the Group’s technology and product portfolio.”
Components in Electronics
Knowles Capacitors have made a number of changes within their sales and product management teams. Changes were brought into effect in October 2015 to continue a program of internal restructuring designed to fully leverage skill sets and put Knowles in the best position to service customers and grow revenue in 2016. Simon Mao, previously Asia Marketing Manager, is now in the position of Product Manager of MLC’s. By staffing the position in China, Simon will be best positioned to work closely alongside the Suzhou factory operations team where Knowles commercial MLC products are made. It will also enable him to work closely with the Asian market where the company sees significant growth opportunities for commodity product lines. Simon brings an in-depth understanding of products, applications and markets to the position, and his past experience in sales, marketing, research and analysis will allow him to bring a fresh perspective to this key role. Chris Noade, previously Product Manager of MLC’s, has accepted the
position of European Sales Manager with responsibility for the full product portfolio. In this role Chris will focus on key account development and relationship management. Having been with the company for nearly 20 years - in a range of sales and marketing roles - his great understanding of the products and customers will help to further develop the company’s sales presence.
Renesas Electronics and TTTech to collaborate on new ADAS-ECU development
Renesas Electronics, a premier supplier of advanced semiconductor solutions, and TTTech Computertechnik AG, a global leader in robust networking and safety controls, have announced their agreement on collaborating on a development of a new automotive platform solution, aimed at providing a future proof, high- performance advanced electronic control unit (ECU) development platform for driver assistance systems (ADAS).
The automotive platform solution will integrate Renesas’ automotive control microcontroller (MCU), the RH850/P1x, and high-performance R-Car system-on- chips (SoCs) with TTTech’s TTIntegration, a software platform, to enable highly complex automotive solutions including highly automated driving. Additionally to the physical integration, the development platform achieves parallel, multi-vendor development and integration of individual software components. Currently, expectations towards autonomous vehicles are growing and there is a demand for realising highly automated functions at low power consumption. The increasing abundance of image sensor information, its assessment and resulting actions require hardware and software implementations that have high performance and safety standards. Furthermore, the assembly of a variety of sensors and functions means new challenges for the implementation of software. This is due to the fact that technologies from different suppliers must be developed in parallel and integrated together as smoothly as possible. These different software packages have to share the resources of available CPUs, hardware
accelerators and communication networks in operation, without interrupting other applications by blocking shared resources. The collaboration between Renesas and
TTTech is designed to respond to these software implementation challenges. The flexibility during development and product definition will continue to grow as the software components are no longer tied to individual semiconductors, but can run on different MCUs, SoCs, and on one or more ECUs. In order to ensure the necessary safety during operation, various Automotive Safety Integrity Level (ASIL) levels (Note 1) on a common automotive open system architecture (AUTOSAR) interface will be made available. Renesas adds its expertise in this collaboration as a globally leading semiconductor solution supplier to the automotive sector, providing high- performance and low power semiconductor solutions, including MCUs, SoCs, middleware and development kits, to the mass markets, which are requiring cost-sensitive implementation of safety and comfort features. Renesas provides system manufacturers the choice and timely integration of best-in-class software through open application programming interfaces (APIs) and leading tools. Renesas enables functional safety up to ASIL-D, the highest level of functionality safety standard out of ASIL, in its semiconductors, meeting the high demands for security in road traffic. The stringent development of product families brings the developer a high degree of scalability for products that can cover all segments - from premium to entry-level vehicles.
www.cieonline.co.uk
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