Imaging magic inMunich

Europe’s largest photonics trade fair, Laser World of Photonics, will include a host of imaging technology when it opens in Munich from 26 to 29 June


aser World of Photonics will run a 24-hour student engineering competition called a Makeathon (make-marathon) when it takes place at the end of June. Around 31,500 visitors and 1,250 exhibitors are expected to attend the trade fair in Munich.

Te Makeathon will be a 24-hour soſtware and hardware development competition in which participating teams of students and young engineers compete to produce preliminary prototypes. Between 80 and 100 students are expected this year, with 10 to 20 per cent of these predicted to be international. With an ever-increasing need for young people in the photonics industry, the Makeathon is intended to promote innovation and recruitment in aspiring students and engineers.

Particular focus at the show this year will be paid towards sensors, cameras, test, measurement and imaging – the core components behind the self-correcting production processes of Industry 4.0. In 2015, 520 exhibitors and 21,600 visitors attended the show to explore these topics. Agricultural imaging is also an application area

Andor Technolgy will be exhibiting the iStar sCMOS, an ultrafast platform for nanosecond time- resolved imaging and spectroscopy.

Te iStar sCMOS features a combination of high frame rates – up to 40fps (4,000 with ROI) – through a USB3 interface, better than 2ns gating, high sensitivity, gen 2 and 3 image intensifiers, and an integrated high resolution triple output digital delay generator. It also offers a dual-frame mode with optical inter-frame down to 100ps for ultrafast flow PIV-type applications.

Te iStar sCMOS’ high frame rates, high multi-track acquisition rates and dual-frame (PIV- type) capabilities provide a perfect complement to Andor’s nanosecond-gated, high-resolution CCD-based family – better suited for less speed- demanding applications.

of growing interest in the photonics industry, and the show will display sensor technologies used in this market.

Tis year, 56 per cent of visitors and 61 per cent of exhibitors will come from overseas to explore the 55,000 square metres of exhibition space. A section of one of the exhibition halls has been set aside to showcase the latest developments in imaging technology. Running parallel to the show at the Munich International Congress Center will be the World of Photonics Congress, the meeting place of the scientific elite of the photonics industry.

Tis innovative platform enables faster characterisation of transient plasma or fluorescence dynamics, Echelle spectrograph-based screening by LIBS or extended multi-track acquisition for hyperspectral imaging. It is also ideally suited for applications such as PLIF imaging for combustion studies.

Line-scan camera manufacturer Chromasens will display the latest generation of its 3DPixa 3D stereo line scan colour cameras at the show. Te new 3DPixa HR 3D is engineered for challenging electronics, semiconductors and automotive manufacturing inspection. Te camera is available in two models: Te 3DPixa HR 5µm,

which has a field of view of approximately 35mm and a scanning speed of up to 30kHz, allowing for very short inspection times at a resolution of 5µm; and the 3DPixa HR 2µm, which is designed for applications requiring even higher resolution and precision, and covers a 16mm field of view, achieving 0.5µm-height resolution, twice the resolution of previous 3DPixa versions. Both cameras capture 2D colour and 3D data images simultaneously.

Numerous different technologies will be on show from Framos, ranging from sensors to complete systems. Te new LED

Effi-Lase V2 projectors from Effilux are a simple, alternative solution to lasers. Tey are ideal for applications such as 3D triangulation, positioning and stereovision, and will be featured in a live demo at the booth. Framos will also present the Euresys Coaxlink Quad 3D-LLE in a live demo. Also on display will be: Smartek Visions’ Twentynine series, which combines either USB3 Vision or GigE Vision with the latest CMOS sensors in a miniature housing; the Emergent HR series for high-speed applications, with a 10GigE interface offering 338fps at 2 megapixels or 32fps at 20 megapixels; and the PCIe 3.0 CoaXPress frame grabber with four camera connections, which generates 3D maps with 16-bit colour depth in real time.

Laser Components will be showcasing its Flexpoint Mini laser diode module, which is now available in 520nm and can be used in 3D imaging. Te optical

power can be set to any value between 0.4-5mW and, depending on the chosen optical power, the laser safety level will be either class 1, 2, or 3R. Te Flexpoint Mini offers an 8 x 40mm housing.

44 Imaging and Machine Vision Europe • June/July 2017 @imveurope

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