electronica 2018 ADVERTORIALS Rugged and reliable B2B®
SMT connectors B2B®
High Density SMT Connectors from Advanced Interconnections Corp. are designed for long-life applications and robust handling. Superior quality is designed-in from our screw-machined terminals with multi-finger contacts to the heavy-duty, shrouded design which provides positive polarization to aid in blind mating applications. Standard and customized footprints, on 1.27mm pitch, feature our proprietary solder ball terminal board interface, preferred
in medical and mil/aero applications for its superior processing and long-term reliability. Low stack heights, high I/O density (over 400 contacts per square inch), and the compact insulator conserve valuable PC board space.
Visit
www.advanced.com to learn more or to contact a local, authorised distributor.
Advanced Interconnections Corp.
www.advanced.com/products/board-to-board-connectors/ b2b-smt-connectors
high density New evaluation board for standard oscillators
How many times have you thought that you wished you had a quick and simple way of testing an
oscillator? Now there is no need to worry about designing and building your own test circuit as you can use the new IOSC-EV Board available from IQD and our distributors. This can be used to test standard surface mount clock oscillators, VCXOs or TCXO/VCTCXOs. The Evaluation Board comes with six smaller boards that can be snapped from the side of the main board and onto which different size 4 pad packaged oscillators can be soldered. The smaller board can then be soldered to the main PCB. Two versions available, populated and non-populated the later, LFMISC079433Bulk, will be available free along with the BOM to the first 400 visitors to our stand at Electronica 2018. IQD Frequency Products will be in hall A6 and stand 314
www.iqdfrequencyproducts.com/ AirCool PRIME family of thermal chucks
The AirCool PRIME family of thermal chucks, developed in collaboration with MPI
Corporation, features the fastest transition times in the industry, offering increased test throughput
With a broad range of capabilities and advanced technical solutions Molex leverages innovative products of tomorrow. From connectors, cable and PCB assemblies, printed circuit and antenna solutions to fully integrated network solutions for smart buildings, smart cars and datacenters – our comprehensive expertise goes far beyond connectors to make our customers’ visions become reality.
Molex offers solutions and services for many markets globally, including Connected Home, Smart Buildings, Connected Mobility, Transportation, Industrial Automation, Healthcare, Datacenter and Telecom Infrastructure.
Visit us at Electronica at booth B3.131 and see how we can support you. We make your vision real.
Molex, LLC
www.molex.com
EDAC will be exhibiting at Electronica 2018 13th – 16th November and showcasing a vast array of
interconnect solutions. Stand number C2.335 We are pleased to welcome our existing customers as well as potential new customers who require high quality products at a low applied cost
Our booth is shared with our sister organisations MH Connectors and NorComp, with whom we make up the EDAC Group of Companies.
EDAC have a proud record of supporting the manufacturing industry with interconnect solutions for more than 50 years.
With low MOQ’s, short lead times and flexible tooling options we are able to offer the right solution to our customers and our range now includes new and
innovative waterproof connectors, alongside many established products such as Card Edge+, D- Sub, USB – A, B, & C Types, HDMI and Rack & Panel ranges.
EDAC’s customer solution capabilities set us apart, producing bespoke products for high- reliability applications such as wind turbines, data storage, and railway signalling. All custom-made solutions are engineered to meet customer’s specific needs and challenges.
www.edac.net/
Future Electronics is a global leader in electronics distribution, with an impressive reputation for developing efficient, comprehensive global supply chain solutions. Come and see us at the show, Hall C3 Booth 321.
www.futureelectronics.com/
Initially available for 300 mm wafers, the ERS AirCool PRIME incorporates a customisable and
modular top plate design allowing easy field upgradeability. Due to the integration of the PRIME Thermo Shield (PTS) into the chuck, the AirCool PRIME products drastically shorten the soaking times within the test cycle. Its ultra-low signal noise in the single-digit Femto-Ampere (FA) range allows extremely sensitive measurement. The system can be configured in a variety of temperature ranges between -60°C and 300°C, depending on the customer's requirements and budget.
ERS has been supplying innovative thermal test solutions to the semiconductor industry since 1970 and is famous for fast-ramping and precise low-noise thermal systems (-65°C to +400°C) for analytical, parametric and wafer sort probing up to 300mm.
www.ers-gmbh.com/
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