Advertorials SMD heatsinks on Tape & Reel


The demands for efficient heat dissipation of electronic devices on the PCB have not been reduced. The increased complexity of the assemblies, as well as the combination of individual functional modules into one component, lead to an unwelcome and, in the long run, harmful power loss on the PCB, which is directly converted into heat. However, too much heat does not only damage the electronic devices on the PCB, but can also affect solder joints and the PCB material itself in the long term. Therefore, the use of heatsinks is essential and indispensable for multiple applications on the PCB. Especially for these applications, Fischer Elektronik offers extremely efficient SMD heatsinks of the ICK SMD ... series, in future various types also in tape & reel design. SMD heatsinks are made of a highly thermally conductive aluminium alloy and are manufactured using an extrusion process. The respective heatsink geometry as well as its weight are adapted for surface mounting on circuit boards. The smallest SMD heatsink that can be manufactured using the extrusion process has a contact surface of just 31.5 mm², which corresponds to a weight of 0.24 g. Due to the very low weight of the SMD heatsinks, direct mounting on the device surface is also possible without damaging the soldering of the device on the PCB through mechanical stress. The SMD heatsinks are offered in black anodised and solderable tin-plated surface finishes. The black anodised heatsinks are mounted on the device using double-sided adhesive heat-conducting foils or 2-component epoxy resin heat-conducting adhesives. In contrast, SMD heatsinks with a solderable surface coating can be applied directly to the PCB, or more precisely said to an existing copper heat spreader surface that is connected to the device to be cooled, by means of reflow or wave soldering. Solderable SMD heatsinks offer an additional serious advantage through simple integration into the assembly and soldering process of the PCB. Due to standard packaging forms, such as tape & reel, the SMD heatssink can be processed and handled like any other device.


Fischer Elektronik GmbH & Co. KG +49 2351 435-0


info@fischerelektronik.de www.fischerelektronik.de/en/


Comprehensive range of miniature and sub miniature ABS plastic enclosures


Terrington Components stock a vast selection of British manufactured ABS enclosures for a multitude of specialised industries and applications. They are ideal for packaging of small electronic systems, miniature PCB’s and devices such as miniature IoT sensory devices. We have developed our own range of screw lid, flanged mounted and push together screwless style


enclosures and potting boxes since the early 1980’s and originally worked and developed specific sized enclosures on several projects for Maplin Electronics group. Terrington Components concentrate on the miniature and sub-miniature sizes of the general plastic enclosure market with our screw lid range available in standard, deep, long and square combinations. Most sizes are available in various popular colours and our range of inhouse processes from CNC machining through to engraving help to remove the inconvenience of either sub-contracting out or having to produce the finished enclosure in-house.


Terrington Components sales@terrington-components.co.uk www.terrington-components.co.uk Smart Manufacturing more than Smart Metrics


The manufacturing industry has been hearing a lot about the Internet of Things (IoT) and Industry 4.0 in recent years. Principally, IoT should enable manufacturers to make things better, faster, quicker and more sustainably. However, David O’Keeffe, Operations Manager at contract electronics manufacturer (CEM), Trojan Electronics, believes connectivity should not be prioritised ahead of customer value. He explains: “It’s clear that as manufacturers we are driven to make things that perform better, quicker or more sustainably. However, as manufacturers, we rely not only on the use of expensive capital equipment (Capex), but an often diverse and / or complex supply chain and the ability to obtain maximum efficiency from both our operational and production teams. “Proponents of IoT and ‘better connectivity resulting in better data utilisation’ suggest that connectivity harnesses that all important data enabling manufacturers to achieve better asset utilisation. The reality is somewhat different and dependent on several additional factors including the type of production and location of your business. “For example, retrofitting every piece of kit with smart sensors in a typical CEM would require significant investment. That is before there is even any mention of the cloud-based architecture the wealth of data captured will rely on or the upskilling of your production and operational team. “Whilst I agree that full asset utilisation is important, we need to think instead about (1) what we are trying to measure and why and (2) how this enables us to deliver maximum value for our customers.” Key metrics in manufacturing include overall equipment effectiveness (OEE) - the percentage of manufacturing time that is truly productive, and downtime analysis (DAD) - accurately analysing downtime and downtime loss.


Trojan Electronics www.cieonline.co.uk sales@trojanemail.co.uk Omron https://www.omron.com/global/en/


Smiths Interconnect launches high-power connectors for demanding defence applications HBB circular connector series now available in the five-pole version


Smiths Interconnect, a leading provider of technically differentiated electronic components, subsystems, microwave, optical and radio frequency products announces today the launch of its HBB five-pole connector in addition to the already existing single-pole version.


The new five-pole is an expansion on the existing HBB platform. The new configuration consists of the existing size 21 shell but contains five poles, each with size eight contacts as well as two interlock pins. This means that in a very tight space, the customer can run five power lines which increases the connectors’ flexibility and offers the ability to run redundant lines as required. When compared to traditional 38999 screw thread connectors, the HBB series offers a number of additional advantages. “We’re starting to see more hybrid fighting vehicles, and soon we will see all-electric,” explains Mark


Kelleher, Vice President and General Manager of the Connector Business Unit at Smiths Interconnect, “these connectors will be needed for all the ancillary equipment as well as the drive train itself.” The HBB five-pole is also ideal in wider applications within defence, such as missile launcher platforms and ground radar installations, where the requirements for robust high-power interconnectivity are ever-growing.


Smiths Interconnect www.smiths.com


Omron introduces a bi-directional DC power relay specifically for next generation of home renewable energy systems


Omron DMS Europe has launched the first product as part of its new organisation- wide focus on tackling the challenges of climate change and, specifically, helping to drive the change to net zero emission fuels. The new device – the


Omron G9KB – is a PCB power relay that provides bi-directional high power DC switching for the next generation of renewable battery energy storage systems (BESS) for homes and DC wall boxes for electric vehicles (EVs). It can replace two standard uni-directional relays in this type of application. The market for domestic-scale renewable energy generation systems is transitioning from a feed-in tariff (FIT) model where unused (“redundant”) energy from solar panels is fed into the electricity grid, to a self-consumption or larger-scale energy storage system (ESS) that reduces grid dependency and makes it easier to make the most of low or zero emissions power.


SIGLENT presents its first oscilloscope series with 12-bit vertical resolution


Applications from power electronics, medical technology, or the IoT often require fine vertical resolution to analyse signal anomalies. The 8-bit resolution of oscilloscopes commonly available on the market is generally insufficient to record these details. A device with 12-bit analogue-to-digital conversion provides 16x more resolution and is therefore very well suited for these tasks. The maximum benefit of 12-bit resolution can only be achieved with a low-noise front end. The new SIGLENT SDS2000X HD delivers low noise, high resolution, and many standard functions to give Engineers the tools they need to succeed. Telonic Instruments has introduced SIGLENT Technologies new 12-bit oscilloscope series comprising three models the SDS2104X HD, SDSSDS2204X HD and the SDS2354X HD. Compared to 8-bit ADCs, 12- bit systems have 16x higher vertical resolution which provides significantly lower quantisation error.


Telonic Instruments 0118 9786911 Components in Electronics www.telonic.co.uk July/August 2022 57


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