embeddedworld 2018 ADVERTORIALS congatec's new modules are simply better
congatec – a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services – has released new COM Express Compact modules in time with the launch of the 7th generation of Intel®
Core™ SoC processors
(codename Kaby Lake). The new conga TC175 Computer-on-Modules (COMs) with Intel's Skylake successor –the second variant of the current 14nm microarchitecture – are simply better than their predecessors. Compelling features include greater CPU performance, more dynamic HDR graphics thanks to 10-bit video codec, and support of the optional, super-fast 3D Xpoint-based Intel®
Optane™ memory.
Thanks to its compatibility with the previous generation, the widely improved microarchitecture can be integrated in existing embedded systems without additional design effort. The standardized COM Express form factor, congatec's extensive industrial driver implementations as well as personal integration support and individual Embedded Design & Manufacturing services make it particularly easy for developers to integrate this new generation. Target applications are found wherever fanless and completely sealed systems must offer high performance at 15 Watt TDP.
“The four current 15 Watt versions of the 7th generation of Inte Core processors on Intel’s IOTG embedded roadmap provide the performance required by many of the new application fields of embedded computing. Demand is found virtually everywhere: from industrial, medical and transportation applications to infotainment and retail as well as in building and home automation. They will also drive the move towards the latest operating systems like Windows 10 IoT, which boasts enhanced security and locking options for IoT connected appliances,” explains Martin Danzer, Director Product Management at congatec. Of course, all other current operating systems such as Linux 3.x/4.x, Yocto and VxWorks are supported as well.
congatec AG
www.congatec.com
Pin headers for LED application with white insulating body
Illumination concepts in LED technology increasingly requires connectors which meet this new technology. On the one hand there are connectors with small numbers of contact in 2,54 mm and also smaller grids such as 2,0 mm or 1,27 mm. On the other hand the plastic of the used insulating body is increasingly requested in nearly white material. Black insulating bodies absorb a certain amount of light by nature. This results in slides on which shadow effects can occur in the area of the connectors. Following the standard connectors the company Fischer Elektronik has established a new header design in grid 2,54 mm for the LED technology for those soldering processes in THT-, THR- and SMD design in this natural-coloured white LCP plastic. Those are available by the end of the year. Those are single-row pin headers with 1-36 number of contacts. For an automatic assembling process the SMD designs are also available in “Tape and Reel” packings.
The product specialists at Fischer Elektronik
info@fischerelektronik.de will be happy to assist you with any queries you may have or any additional information you require.
Fischer Elektronik GmbH
www.fischerelektronik.de
RTI provides Connectivity and Security Software for IIoT Systems of Systems Hall 4, booth 471
At embedded world 2018 (27 Feb - 3 Mar, Nuremberg, Germany), Real-Time Innovations (RTI) will feature the latest version of their connectivity software for real-time applications, Connext DDS 5.3. The company will also discuss their enhanced security specification, Connext DDS Secure. Demos of the layered- databus architectures can be seen at the RTI booth as well as at partner booths.
RTI Connext DDS 5.3 applications expand across the Industrial Internet of Things (IIoT) including connected medical devices and hospitals in the healthcare market, autonomous vehicles in the transportation market and hydropower and microgrid systems in the energy market. These systems all require sharing data across multiple networks, from the edge to the fog the cloud.
For example, in a connected hospital, devices have to communicate within a
patient or operating room, to nurses’ stations and off-site monitors, to real-time analytics applications for smart alarming and clinical decision support, and with IT health records. This is incredibly challenging given the technical bandwidth, security and interoperability requirements.
To help IIoT system architects address these challenges, RTI released Connext DDS 5.3, the first connectivity software designed to implement a layered databus pattern while also fostering interoperability and an open architecture. RTI Connext DDS complies with the OMG Data Distribution Service (DDS) standard and allows sharing data across multiple networks.
Real-Time Innovations
www.rti.com
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