Interconnection
Smiths Interconnect’s new Volta product pushes testing technology boundaries
S
miths Interconnect, a leading provider of technically differentiated electronic components, subsystems, microwave
and radio frequency products, has launched the Volta Series probe heads, optimised for wafer-level chip-scale package testing.
As phones and smart devices get
more powerful, so do the integrated chips that support them. Volta is used for testing the chips (while in their wafer form) that are behind everything from Bluetooth and power management to digital display controllers. Volta helps customers deliver higher quality products by ensuring the chips in them are up to specification, and perform as they should. Volta is the result of Smiths
Interconnect’s close collaboration with customers, and has been designed to significantly outperform the competition in durability and reliability. It uses innovative, world-class electrical contact technologies
and proprietary-engineered materials to achieve improved performance and production efficiency. In the Volta Series spring probe contacts
are used in place of cantilever and traditional vertical probe card technologies. As part of Smiths Interconnect’s complete line of semiconductor test products, the Volta Series offers a number of differentiating benefits: • The design itself ensures an extremely short signal path enabling low and stable contact resistance, high current carrying capacity and longer life cycle. • Proprietary-engineered plastic and machined ceramic materials used in the product make for improved planarity that allows increased test parallelism. • The housing allows for easy maintenance, quick installation and field repair potential that all add up to reduced cost of ownership.
• The state-of-the-art Volta Manual Actuator (Lid) design allows sorted die
tests at all sites simultaneously as well as eliminates the possibility of die cracking even after repetitive tests, enabling probe card bring-ups prior to the wafer availability.
“The semiconductor packaging industry is evolving quickly to accommodate complex functional integration of ICs for higher performance in smaller form factors,” said Jeff Dick, marketing vice president at Smiths
Interconnect. “The technical challenges and increases in packaging costs are fueling the growth of Wafer Level Packages and Known Good Dies. Smiths Interconnect’s Volta Series addresses these trends with a cost-effective, high- performance option specifically designed to meet customers’ needs.”
www.smithsinterconnect.com/ volta
HARTING offers Han PushPull Power L connectors in robust metal format for easy installation H
ARTING is now offering its Han PushPull Power L connectors in a robust metal format which allows more room for installation and simplifies the wiring process when the
connectors are used with large conductor profiles. These PushPull connectors are typically used with PROFINET cabling as an integrated installation system for data and power transfer to production facilities in the automobile industry. To minimise power loss, cables with a profile of 2.5 mm² are finding increasing use for long cables carrying 24 V supply voltage. Increased installation space makes field assembly with larger conductor profiles a lot simpler: a process that is aided by the user-friendly push-in spring-cage connection. The appropriate metal panel flanges - also with spring-cage connection - plus mounting housings and circuit board adaptors are also available for dust- and splash-proof integration of interfaces for 24 V power supplies to automation components. All components comply with the requirements of the PROFINET cabling guidelines, ensuring unrestricted connector compatibility with all automation devices and components. The cable diameters best suited for these applications are between 9 and 13 mm. Sealing inserts are available as optional accessories for particularly small cables with a diameter of 4-6.5 mm. The connector system complies with protection classes IP65 and
IP67. All connectors can have a simple visible polarisation layout, thus ensuring that the correct connection position can be found quickly and intuitively during the connection process.
www.HARTING.co.uk 16 December 2017/January 2018 Components in Electronics
www.cieonline.co.uk
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