embeddedworld 2018
Manhattan Skyline announces a new range of modules supporting the SMARC Computer on Module standard
S
MARC is the first COM standard to be built specifically for modern ARM-Cortex system on chips (SoCs), aiming to efficiently pass along ARM benefits such as low power consumption to COTS designs.
An overview of the SMARC specification The new standard for ultra low-power COMs was developed specifically for new modules with ARM and SoC processors and is characterised by the extremely flat build of its form factor. It uses a 314-pin connector that has a construction height of just 4.3 millimetres (the MXM 3.0) with an optimised ARM/SoC pin-out definition. This connection method allows robust and cost- effective designs that have an extremely thin construction height. The version of this connector that is shock-and vibration-resistant serves the needs of applications that will need to function reliably under rough environmental conditions. Furthermore, the standard integrates dedicated interfaces for the latest ARM and SOC processors. This means that not only LVDS, 24-bit RGB and HDMI are supported but embedded DisplayPort for future designs is supported as well. As another first for the industry, dedicated camera interfaces are being incorporated into the standard. OEMs benefit from minimised design effort and bill of material costs. Two different module sizes are specified, in order
to offer a high level of flexibility regarding different mechanical requirements: a short module measuring 82 mm x 50 mm and a full- size module measuring 82 mm x 80 mm. Additionally, SMARC will cover all other known requirements analogue to other module standards, so that the SMARC standard is already completely mature for the market. The benefits of standardisation are listed as follows:
• Reduced cost • Mass production equals a better price performance ratio • Improved quality • Mass production equals higher
product quality • Improved negotiating power for the buyer
Standards drive product differentiation and competition toward price and service and away from features. This gives buyer both better pricing and better support. • Standard architectures • Allows software teams to develop new applications faster with fewer people • Scalable and flexible • More module offerings can be applied to the same platform
The SMARC-FiMX7 is a versatile small form factor Computer-On-Module with Qualcomm/NXP
i.MX7 processor and offers scalability with single and dual core processors. SMARC-T335X Computer-on-Modules based on TI Sitara AM335X ARM Cortex-A8 technology (600MHz, 800MHz or 1GHz). This product is aiming to replace
current ARM9, ARM11 and part of the Cortex-A8 markets in higher resolution displays, faster performance and multiple, flexible integrated connectivity options – all while keep the power level low and price competitive.
The highly scalable SMARC-FiMX6 modules with single, dual lite, dual or quad core NXP(Freescale)
i.MX6 processors cover an extremely wide performance range.
www.mansky.co.uk
CIE embeddedworld 2018
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