once the forklift has positioned the mould next to the clamp unit, the mould can then be pushed into position by hand. Height adjustment of the mould, once it is in the clamp, is also easier. Finally, modifications have been made to sealing plate and stretch rods, and standard screw fittings for the water cooling system have been replaced by quick-fit push/pull fittings. Ewikon has introduced a cold runner solution

Above: Sipa has introduced a new quick mould change system for its ECS SP single-stage injection-stretch-blow moulding machines. The system is capable of producing all sorts of shapes, including the production of miniature bottles as small as 10 ml in size

Right: The Coolshot cold runner system from Ewikon allows process reliability and efficient processing of various types of LSR

units, valve guides and nozzles. Sipa has also introduced a new quick mould change system for its ECS SP single-stage injection- stretch-blow moulding machines, which means changeover times can be reduced by around a quarter. New features also add extra safety and user-friendliness for operators, especially for some critical operations. The Sipa ECS SP system is claimed to be ideal for the production of speciality products, such as containers for pharmaceuticals, cosmetics, personal care products, and spirits, particularly (but not exclusively) in sizes between 20 and 50 ml. Two models are available: the ECS SP 50 with a 500-kN injection clamp force, and the 800-kN ECS SP 80. The system involves a new automated procedure for loading and unloading the preform core plates; this incorporates additional sensors to ensure that the mould opening stroke is adjusted correctly, according to the preform length. Operations for assem- bling and disassembling the neck ring plate have also been modified. Sipa has devel- oped a system that now makes it possible for the procedure to be carried out safely by one person instead of two. Changing the blow mould is also easier. Modifi- cations to the press and the introduction of roller bearings in critical positions, for example, now mean that

38 INJECTION WORLD | November/December 2018

for the processing of LSR. The company says that the high performance Coolshot cold runner system allows process reliability and efficient processing of various types of LSR. The system features an electric drive valve gate, which has already been success- fully used for years in hot runner applications. When processing LSR the electric step motors used allow the positioning of the valve pins with high precision in steps of 0.01 mm, enabling fine-balancing of the cavity filling. No manual adjustment of the valve pin length is required, meaning that the time for system set-up and re-adjustments during production is considerably reduced. Furthermore, the advanced control technology allows permanent monitoring and automatic adjustment of the valve pin positions by using encoders. There is a touch screen panel for operation of the system and remote control access is possible by tablet PC (iOS, Android, Windows) with VNC viewer. The company adds that all components of the system are designed for maximum reliability and easy maintenance. The manifold system features a fully balanced flow channel layout without dead spots for quick colour changes and can be easily dismantled and opened for cleaning. Depending on the LSR type used, the water-cooled cold runner nozzles are available with different material combi- nations in the gate area. Consequently the thermal separation can be tailored to the process. This allows production at the optimum mould tem- perature and with reduced cycle times. A heated separator plate with coil heater and separate temperature control for each cavity is also available. This technology from the hot runner field enables a particularly even heating of the mould plate for homogeneous crosslinking of the LSR. The cavity plate can be equipped with an additional mecha- nism to separate it easily from the cold runner nozzles after production or in case of a temporary interruption. This stops heat transfer from

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