NEWS
Coveris expands in CPP film production
European packaging manufacturer Coveris has acquired Gefo Folienbe- trieb, a German producer of cast polypropylene (CPP) films. Coveris says the integration of Gefo enables it to expand CPP production while broadening its product portfolio across areas including retort packag- ing, lidding films, bakery bags and medical packaging. Before the acquisition, Kufstein was the company’s only CPP extrusion site, and was operating at full capac- ity. It says CPP films are increasingly important in flexible packaging due to their recyclability, and compatibility with mono-polymer structures.
Coveris expects the European CPP
market to grow by around 3% annually – with segments like retort, medical and lidding expected to grow by more than 4%, driven by sustain- ability requirements and the replace- ment of non-recyclable substrates. “Demand for recyclable mono-
material packaging continues to grow across Europe, making the expansion of our CPP capabilities a logical next step,” said Christian Kolarik, CEO of Coveris. “Gefo is an excellent addition to our network and further strengthens our sustainability strategy.” �
www.coveris.com
Key innovations for film stretching lines
Asahi Kasei has built a new slitting facility for its Sunform DFR at its site in Taiwan Slitting expansion in Taiwan
Asahi Kasei has built a new slitting facility for its Sunform dry film photoresist (DFR) at its site in Tainan, Taiwan.
It says this will help it meet growing demand for advanced semiconductor packaging. The new slitting facility represents an investment of around ¥2 billion (US$12 million) and will expand capacity by 40% with the potential to double current output, says the company.
DFR used in semiconductor
www.filmandsheet.com
packaging is subject to increasingly stringent standards for quality and supply reliability, it says. Slitting is the process by which master rolls of film are cut into narrower widths to meet customer requirements – and directly impacts product quality and supply reliability.
In May 2025, Asahi Kasei launched
Sunform TA, a DFR series tailored for advanced semiconductor packaging used in AI servers. �
www.asahi-kasei.com
www.brueckner.com
▪ Greenline concept for saving energy and raw materials
▪ 12m lines: Increased productivity and efficiency
▪ Solutions for recyclate use
▪ Heat recovery unit reducing operating costs
IMAGE: ASAHI KASEI
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