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June 2025
Creform Develops Five-Level Shelf Cart
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GREER, SC — Creform Corpor - ation has designed a five-level shelf cart for an aerospace parts manufacturer’s facility. The five- level cart helps improve the user’s workflow efficiency and minimize downtime by ensuring all necessary components are easily accessible and simplifies restocking and inventory track- ing by centralizing items in a designated location. This cart features five light-
weight corrugated plastic shelves supported by Creform pipes and includes custom foam cutouts to provide product stability and pro- tection while the cart is in motion. The number of levels enhances organization of tools, components, and materials neatly at the point- of-use area. The adjustable shelves can also be set to ergonomic heights for associates and helps reduce the likelihood of errors or defects in the assembly process by keeping parts clean, organized, and ready for use. The cart’s dimensions are 58
x 40 x 63 in. (1.47 x 1.02 x 1.6m) and it is designed to hold up to 800 lb 362.87 kg. The unit is con- structed with Creform 1.1 in. (28 mm) white gray color pipe and black metal joints. Creform shelf carts allow users to create tai-
lored solutions that fit their spe- cific needs, whether it’s size, number of shelves, or additional features.
Material handling shelf cart. The cart features four swiv-
el casters and two fixed ergonom- ic casters that provide for easy rolling, positioning and maneu- verability. The swivel casters at the corners ensure stability and allow the cart to be pushed down aisles but also easily moved lat- erally.
Contact: Creform Corp.,
P.O. Box 830, Greer, SC 29652 % 800-839-8823
E-mail:
scsales@creform.com Web:
www.creform.com
ROHM Develops SiC Power Modules
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SANTA CLARA, CA — ROHM Semiconductor has developed new four-in-one and six-in-one SiC molded modules in the HSDIP20 package optimized for PFC and LLC converters in onboard chargers (OBC) for EVs (electric vehicles). The lineup includes six mod-
els rated at 750V (BSTxxx - 1P4K01) and seven products rated at 1,200V (BSTxxx 2P4K01). All basic circuits required for
power conversion in various high- power applications are integrat- ed into a compact module pack- age, reducing the design work- load for manufacturers and enabling the miniaturization of power conversion circuits in OBCs and other applications. In recent years, the rapid
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electrification of cars is driving efforts to achieve a decarbonized society. Electric vehicles are see- ing higher battery voltages to extend the cruising range and improve charging speed, creating a demand for higher output from OBCs and DC-DC converters. At the same time, there is an increasing need in the market for greater miniaturization and lighter weight for these applica- tions, requiring technological
SiC molded module for EVs. ROHM’s HSDIP20 package
addresses these technical chal- lenges that were previously becoming difficult to overcome with discrete configurations, con- tributing to both higher output and the downsizing of electric powertrains. The HSDIP20 fea- tures an insulating substrate with excellent heat dissipation properties that suppresses the chip temperature rise even dur-
ing high-power operation. Contact: ROHM
Semiconductor USA, 2323 Owen
Street, Santa Clara, CA 95054 % 408-720-1900 E-mail:
hmueller@rohmsemiconductor.com Web:
www.rohmsemiconductor.com
breakthroughs to improve power density, while enhancing heat dissipation characteristics that could otherwise hinder progress.
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