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Page 34


www.us-tech.com


June 2025


BTU Offers Aurora 175N Reflow Oven


WESTFORD, MA — As part of BTU’s Aurora platform, the 175N model delivers exceptional ther- mal uniformity, advanced process control, and intelligent power-sav-


gy consumption during idle time and optimizes recovery for seam- less production ramp-up. The Aurora’s advanced con- trol system, Wincon 8, provides


Selective Soldering Wave Soldering Reflow Soldering Factory Automation THT-AOI Know How and Training


Aurora 175N reflow oven.


ing capabilities, all in a compact, configurable footprint. The system is built to meet the demands of today’s high-throughput, high-reli- ability manu facturing environ- ments, and is ideal for applications in automotive, telecom, and ad- vanced consumer electronics. Designed with efficiency and


ease of use in mind, the Aurora 175N incorporates BTU’s propri- etary Aqua Scrub™ flux manage- ment system, a fully automatic, water-based solution that keeps the oven atmosphere clean while reducing manual maintenance. The oven also features Smart Power and Energy Pilot software, which automatically adjusts ener-


users with a modern, SEMI E95- style interface and seamless in- tegration with factory MES plat- forms. Operators benefit from real-time process monitoring, SMS/email alerts, and intuitive tools for recipe management and traceability. With support for dual-lane, dual-speed conveyors, and configurable heating and cooling zones, the Aurora 175N delivers both performance and flexibility, making it a future- ready solution for manufacturers


embracing Industry 4.0. Contact: BTU International,


Inc., 10 Lyberty Way, Westford, MA 01886 % 978-667-4111 Web: www.btu.com


ASMPT Addresses Tech Challenges with SIPLACE


Smart Systems with Pure Efficiency


 


SUWANEE, GA — The rapid de- velopment of artificial intelli- gence is driving the demand for high-performance processors and placing great demands on elec- tronics manufacturing. ASMPT is meeting these challenges with innovative placement technology that is capable of processing both super-miniaturized components and large, heavy AI chips with exceptional precision. With automated measure-


ments, intelligent vision systems and adaptive placement mecha- nisms, SIPLACE placement plat- forms deliver error-free assembly processes, even for components with thousands of contacts arranged in complex patterns. Modern 0201 components


SEHO North America, Inc. www.sehona.com


are smaller in width than a human hair and get placed with extremely tight pitches. As a re- sult, their housing can no longer self-center during the reflow process, so that even the smallest misalignment leads to a short cir- cuit, making the whole product unusable. SIPLACE placement machines measure each compo- nent individually and use their rotating head segments to com- pensate for any pickup offsets. Each segment can be rotat- ed individually. After the compo-


nent has been picked up, it is brought to the placement posi- tion on its way to the camera, for example at an angle of 90 de- grees. After the optical measure-


Automatic center of gravity detection.


ment, only a minimal angle cor- rection is required, which is usu- ally less than 1 degree. This unique principle in the SIPLACE placement machines not only achieves the highest placement accuracy, but also allows any placement angle, such as 35 de-


grees, to be realized. Contact: ASMPT, 3975


Lakefield Court, Suite 106,


Suwanee, GA 30024 % 770-797-3189 E-mail: ogden.mark@asmpt.com Web: www.asm-smt.com


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