June 2025
www.us-tech.com
HARRISBURG, PA — Cumberland Electron- ics Strategic Supply Solutions (CE3S) has in- troduced the Millice StripAid™ X series, a biodegradable, nonhazardous solvent de- signed to effectively remove WaferGrip™ and TrueGrip™ adhesives. Offering an envi- ronmentally responsible alternative for labo- ratories and semiconductor manufacturers, StripAid X provides a seamless and efficient cleaning process while ensuring surface in- tegrity.
StripAid X is formulated to work at both
ambient and elevated temperatures, making it versatile for various applications, includ- ing ultrasonic agitation. It is particularly ef- fective in debonding diced and whole wafers, such as after the wafer thinning process.
BEST Inc. Offers BGA Reballing Process
ROLLING MEADOWS, IL — BEST’s EZReball™ is a reballing preform that consists of an array of solder spheres positioned with a high-temperature polyimide stencil and an adhesive-backed carrier to hold the solder balls in their precise location. These pre- forms can be made quickly with- out tooling charges in almost any possible array pattern, including various solder alloys, lead pitch- es, and ball diameters. BEST’s EZReball preforms
are manufactured from a special- ty high temperature-rated film which aligns the balls with the corresponding array. The pre- forms are cut using a precision laser to meet exacting device re- quirements. Solder balls are cap- tured and retained by the pre- form and are aligned to the prepped BGA device and re- flowed. After reflowing the pre- form is simply peeled away. Pre- forms can be used on the small- est pitch CSPs and BGAs. A significant benefit of the
EZReball process is that the re- balling preforms will accurately place a new array of solder balls relying on simple physical proper- ties rather than requiring opera- tor dexterity or skill. Other re- balling methods that use loose sol- der spheres typically process only one component at a time. EZRe- ball preforms enables processing of several parts at the same time with only a few minutes of labor. Based on time studies of re-
balling 10 or more devices, EZReball method has shown to be 30% faster than other re- balling methods using metal stencils. EZReball is in full com- pliance with the IPC 7711/21
Procedure 5.7.6. for BGA rework Contact: BEST, Inc., 3603
Edison Place, Rolling Meadows, IL 60008 % 847-797-9250 E-mail:
nash.bell@
solder.net Web:
www.solder.net
Millice StripAid X series adhesive removers.
CE3S Introduces Adhesive Remover
The process is simple: wafers are soaked in StripAid at 230°F (110°C) for 5 to 20 min-
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utes, followed by sequential rinses with ace- tone, IPA, and DI water. The solvent’s low vapor pressure and negligible solubility in water make it easy to handle without requir- ing special safety precautions. Unlike conventional solvents, StripAid X
aligns with sustainable manufacturing goals, offering a biodegradable solution without compromising efficiency. Its nonhazardous formulation simplifies storage requirements — only protection from direct sunlight is
needed. Contact: Cumberland Electronics Strate-
gic Supply Solutions, 2501 Sycamore Street, Harrisburg, PA 17111 % 717-232-9715 E-mail:
jwagner@ce3s.com Web:
www.ce3s.com
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