June 2025
FREMONT, CA — Saki Corporation has in- troduced significant enhancements to the image processing capabilities of its 3Xi-M200 automated X-ray inspection (AXI) system. The latest software update introduces ad- vanced functions that improve inspection ac- curacy for solder joint defects in complex power module assemblies. When combined with Saki’s existing shadow correction filter, which addresses challenges associated with heat dissipating pin-fin structures, the up- date further reinforces Saki’s capability in high-precision X-ray inspection for complex power modules, including those with thick, heat-dissipating finned baseplates. In power modules, solder joint quality is
critical to reliability. In particular, voids in the solder layer can signif- icantly impact thermal and electri- cal performance, making high-res- olution, high-sensitivity X-ray in- spection essential for quality as- surance in manufacturing lines. Power modules, which man-
age high currents and voltages, typically incorporate complex ther- mal designs such as large power
Heraeus Electronics Debuts Die Top System Material
WEST CONSHOHOCKEN, PA — Heraeus Electronics has debuted its DTS® Silver, a next-generation die top system material designed for high-performance applications at an optimized cost. The Heraeus DTS enables copper wire on sin- tered power semiconductors, de- livering exceptional flexibility. DTS enhances electrical and ther- mal conductivity, strengthens die connection reliability, and opti- mizes overall module perform- ance. The innovative solution DTS Silver is free of palladium and gold, offering a cost-efficient yet highly reliable alternative for power electronics manufacturers. Heraeus also offers its Con-
dura®.ultra, a silver-free AMB bonding technology for metal-ce- ramic substrates. Designed for high-end applications and with a low total cost of ownership Con- dura.ultra maintains outstanding reliability. Condura.ultra enables the use of thicker copper layers while allowing thinner ceramics, maintaining equal thermal resist- ance compared to traditional AlN substrates. With high thermal conductivity (>80 W/m-K), this in- novative material is ideal for sin- tering, bonding, and soldering processes, offering exceptional
performance. Contact: Heraeus, Inc.,
24 Union Hill Road,
West Conshohocken, PA 19428 % 215-944-9981 E-mail:
jeffery.oddo@heraeus.com Web: www.heraeus-
electronics.com
www.us -
tech.com
devices and finned heat sinks to ensure effi- cient heat dissipation. These architectures
Page 29 Saki’s AXI Upgrade Enhances Image Noise Reduction
often result in significant height variations and intricate, multilayered structures that in- clude solder layers and heatsinks. Such com- plexity poses a challenge for conventional 2D X-ray imaging, which are unable to effectively detect defects within such structures with suf- ficient accuracy. Saki’s 3Xi-M200 AXI system overcomes these limitations with its unique planar CT technology, which separates indi- vidual layers to enable highly accurate void de- tection and defect analysis, even in densely
structured assemblies. Contact: Saki America, Inc., 48016
Enhanced image clarity through noise reduction.
Fremont Boulevard, Fremont, CA 94538 % 510-623-7254 E-mail:
sales.us@
sakicorp.com Web:
www.sakicorp.com
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