Page 26
www.us-tech.com
June 2025 ElEctronic Mfg Products Seica Presents VALID LR Test System
HAVERHILL, MA — Seica has introduced its new VALID LR system, designed to provide a solution for customers looking to replace legacy test systems that are no longer supported by the original manufactur- ers. The native multi-resource architecture of the VALID LR gives it the flexibility and performance required for the seamless migration of existing test programs and fixtures, while preserving original fault coverage, ensuring a smooth transition for users. The hardware and
VALID LR test system.
software of Seica’s VIP™ platform combine the capa- bility to support older tech- nologies with high per- formance, state-of-the-art tools, which are then also available for the develop- ment of new test programs, in addition to the legacy re- placement of existing ap- plications. The VALID LR sup-
ports a full range of test
performances including in-circuit test, functional test, dynamic digi- tal test and boundary-scan test. In addition, it can be configured with a range of additional resources such as LED tests, onboard program- ming (OBP) capability, and third-party instrumentation.
VALID LR is engineered for high scalability and performance,
with an innovative, cableless architecture, supporting up to 5888 channels with a 1:8 digital multiplexer. It offers up to 24 programma- ble power supplies ensuring the capability for flexible management of power-on tests. The intuitive, customizable operator interface is built on a PLC system with OPC-UA communication for seamless integra-
tion into modern test environments. Contact: Seica, Inc., 110 Avco Road, Haverhill, MA 01835 % 603-890-6002 E-mail:
davidsigillo@seicausa.com Web:
www.seica-na.com
COT Intros Gripper for ASMPT SMT Machines
GAINESVILLE, GA — Count On Tools, Inc. (COT) has launched its latest gripper technology designed for ASMPT surface mount ma- chines, enabling enhanced compo- nent handling ranging from 0.08 to 0.24 in. (2 to 6mm). This break- through innovation boosts preci- sion, flexibility, and efficiency in electronic assembly production. The new gripper system is
engineered to securely grasp and place delicate,
irregularly
shaped, or non-standard compo- nents that traditional vacuum- based pick-and-place heads struggle with. The technology ensures a firm yet gentle hold, preventing component damage while maintaining high-speed, high-accuracy placement across various applications. The gripper accommodates a
broad range of component sizes, making it ideal for diverse PCB designs. Advanced motion con- trol and gripping force adjust- ment ensure secure handling of fragile and irregularly shaped
components. It reduces misplace- ments and improves overall yield in high-mix, low-volume, and high-reliability electronics man- ufacturing. It is designed for easy compatibility with ASMPT’s latest SMT platforms, offering a streamlined adoption process for manufacturers.
Gripper for complex component handling.
Contact: Count On Tools, Inc., 2481 Hilton Drive, Suite 3,
Gainesville, GA 30501 % 770-538-0411 E-mail:
ccouch@cotinc.com Web:
www.cotinc.com
SHENMAO Offers High Reliability Solder Paste
SAN JOSE, CA — SHENMAO America is now offering its PF606-PW220 lead-free water- soluble solder paste. This inno- vative material is designed to meet the growing demand for re- liable, easily cleanable soldering solutions in high-reliability PCBA applications. PF606-PW220 features a
DL Technology has been the leader in micro dispensing technology for over 15 years. For more
www.dltechnology.com 216 River Street, Haverhill, MA 01832 • P: 978.374.6451 • F: 978.372.4889 •
sales@dltechnology.com
halogen-free (ORH0) formulation with no halogen intentionally added, ensuring compliance with global environmental regula- tions including RoHS, RoHS 2.0, and REACH. One of its most no- table advantages is its ease of cleaning. Residue can be effec- tively removed using only hot water, simplifying post-soldering processes and supporting clean- er, more sustainable manufac- turing environments.
The solder paste also deliv-
ers outstanding voiding perform- ance, excellent solderability, and high print consistency. These characteristics help improve yield and ensure strong, reliable joints across a wide range of sur- face finishes and component types. PF606-PW220 is particu- larly well-suited for surface mount and ground pad soldering in applications where low ionic residue and high-quality solder joints are critical, such as telecommunications, automotive electronics, industrial control
systems, and medical devices. Contact: SHENMAO Ameri- ca, Inc., 2156 Ringwood Avenue,
San Jose, CA 95131 % 408-943-1755 E-mail:
usa@shenmao.com Web:
www.shenmao.com
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72
