June 2025 Continued from previous page
www.us-tech.com
Cost: Selective soldering has an increased set up cost for the special equipment needed. But, it is economical for low-volume or high- precision production. Wave soldering can result in reduced cost per board in mass production, since the process is automated and can handle large num- bers of boards simultaneously.
Component Spacing Components that are too close
together may make it impossible to use the selective soldering process by allow- ing the molten solder from the nozzle to contact adjacent components. In wave soldering, such SMT components
New Laser Marking System
from Exatron SAN JOSE, CA — Exatron has added to its extensive line of laser marking solutions with the Model 650 LIM. Featuring a lin- ear motor-driven XY table and Exatron’s Smart Mark add-a- mark methodology, the 650 LIM ensures precision and flexibility when marking wafers or ICs in waffle packs, JEDEC, and cus- tom trays. During production, full or
partial trays are first inspected by a Keyence camera equipped with a telecentric lens. The X, Y, and theta data of each individual IC or of the entire tray, depend- ing on job specifications, are measured and sent to the Keyence laser marker, where off- sets are added to a previously saved laser mark file to ensure precise laser mark alignment on each IC. Laser mark files are built such that new laser marks are positioned around existing markings, a process Exatron calls Smart Mark. Inspection- assisted alignment ensures old and new marks do not overlap and are uniformly placed. The linear motor-driven X and Y axis table is equipped with digital encoders, which allow precise movement with a resolution of 0.001 in. (0.03 mm) at up to 60 in./s (150 cm/s). The Keyence laser can be
specified at 4.92 x 4.92 in. (125 x 125 mm) or 12.99 x 12.99 in. (330 x 330 mm). The Model 650 LIM is easily configurable to mark wafers, waffle packs, JEDEC, and custom trays. It includes a Windows 11 touchscreen inter- face, intuitive auto run and diag- nostics software, and is designed, manufactured and assembled at Exatron in San Jose, California. Contact: Exatron, Inc., 2842
Aiello Drive, San Jose, CA 95111 % 1-800-392-8766 E-mail:
sales@exatron.com Web:
www.exatron.com
Selective soldering.
may be exposed in a wave pallet opening and cause a solder bridge. This can add cost, reduce throughput and negatively affect quality.
Page 49
Securing PTH Parts with Selective and Wave Soldering... Depending on the soldering method
being used, ensure minimum spacing of 2 to 5 mm for selective soldering and 3.75 to 7 mm for wave soldering on the solder side from lead-free soldered THT component pad edge to component bodies or pads of SMT components. If this is not fixed at the design
level, then the assembly house must apply chip mask on such SMT parts to prevent issues. Contact: Rush PCB, Inc., 2151-20
O’ Toole Avenue, San Jose, CA 95131 % 408-496-6013 E-mail:
roy.rushpcb@
gmail.com Web:
www.rushpcb.com r
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72
