search.noResults

search.searching

saml.title
dataCollection.invalidEmail
note.createNoteMessage

search.noResults

search.searching

orderForm.title

orderForm.productCode
orderForm.description
orderForm.quantity
orderForm.itemPrice
orderForm.price
orderForm.totalPrice
orderForm.deliveryDetails.billingAddress
orderForm.deliveryDetails.deliveryAddress
orderForm.noItems
July 2026


www.us - tech.com


.STUTTGART, GERMANY — Bosch has presented a new gen- eration of ultrasonic chipsets for close-range perception in vehi- cles. The new TB193 and TB293 chipsets enable more precise de- tection of objects such as parked vehicles or curbs and allow for accurate measurement of the distance to them. For the first time, these solutions process the raw signals directly from the ul- trasonic sensors. This provides a significantly larger and more de- tailed data set. Ultrasonic sensors already


help drivers to park safely. The new generation from Bosch goes one step further by using the orig-


KYOCERA AVX Releases Multilayer Varistors


FOUNTAIN INN, SC — KYO - CERA AVX has added new high- temperature, automotive-grade multilayer varistors (MLVs) engi- neered for 48V power supply sys- tems to its proven TransGuard®


inal, unprocessed signals from the sensors. This raw data con- tains significantly more detail than pre-processed information. This allows AI-based parking as- sistants to better assess the surroundings, which is particu- larly beneficial in tight parking garages with many pillars and walls, or when vehicles are parked close together. In addition to objects,


road conditions like wet or varying surfaces can also be detected, enabling additional features such as smarter brak- ing decisions.


The new chipsets capture


and process ultrasonic data di- rectly at the source. One chip controls and pro - cesses the data, while the other


Page 59 Bosch Presents Ultrasonic Chipsets for AI


chip captures the actual sensor signals. Together, they deliver exactly the information that AI- based parking or brake assis- tance systems need. In addition, the chipset architecture pro- vides the necessary data trans- mission speed and bandwidth to handle and transport these large volumes of raw data in real time.


Contact: Robert Bosch GmbH, Postfach 10 60 50,


Ultrasonic chipset for vehicle perception.


D-70049 Stuttgart, Germany % +49-711-811-7497 E-mail: hanassios.kaliudis@de.bosch.co m Web: www.bosch.com


Ultra-Precise Laser Soldering


SB² ®


Highest placement precision and smallest solder ball capability for fine-pitch probe card


Placement accuracy:  +/- 5m


Automotive-grade MLV.


VT series, which was the first in the industry to offer MLVs rated for 175°C operation. TransGuard VT Series high-


temperature, automotive-grade MLVs are zinc-oxide-based ceram- ic semiconductor devices that combine extremely reliable bidi- rectional overvoltage protection and EMI/RFI attenuation capabil- ities in compact, SMT packages that reduce the need for discrete MLCCs, providing both BOM cost and board space savings. They also exhibit high cur-


rent and energy handling capa- bilities, multi-strike capabilities, and low leakage and have the highest human-body model (HBM) electrostatic discharge (ESD) classification — Class 6, which means they can reliably withstand over 25,000V of ESD — and the lowest moisture sensi- tivity level — MSL 1, which means that they have an unlim- ited floor life under the specified conditions, don’t require any spe- cial dry packing or handling pro- cedures, and don’t need to be


baked before reflow soldering. Contact: KYOCERA AVX,


One AVX Boulevard, Fountain Inn, SC 29644 % 864-228-8869 E-mail:


nicholas.kovalsky@avx.com Web: www.kyocera-avx.com


sales@pactech.de www.pactech.com Scan to learn more! 2D 3D& Suitable for chip/ wafer/ substrate soldering


Recommended soldering condition: 2D and 3D soldering


Optional ball rework (de-balling & re-balling) capability: Min. ball size 150 m


Laser Assisted Bonding (LAB) & Laser Assisted Reflow (LAR)


LAPLACE ®


In-situ bonding and reflow for low thermal stress, localized & selective heating with laser


Substitution of conventional multi zone ovens Reduced N consumption by min. factor 10


3.5D ® vertical Laser Assisted Bonding (LAB) technology


Support panel size: 600mm x 600mm


Beam size : max. 90mm x 90mm


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64