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www.us-tech.com


July 2026 ElEctronic Mfg Products


Technica Hosts Tech Day Event on AI and Large BGA Solutions


SAN JOSE, CA —As artificial in- telligence continues to reshape computing hardware, electronics manufacturers are facing new challenges in assembly, inspec- tion, and process control. Those challenges took center stage at Technica USA’s Tech Day event, held May 13-14, 2026, in San Jose, California, where more than 60 attendees and represen- tatives from over 25 companies gathered to explore technologies designed for the next generation of electronics manufacturing. The two-day event combined


technical presentations at the NextFlex facility with live equip- ment demonstrations at Techni- ca’s Demo & Applications Cen- ter, providing attendees with both educational and hands-on opportunities to evaluate emerg- ing manufacturing solutions.


Coming together. Jason Perry, President of


Technica USA, opened the event


ing more than 20,000 solder con- nections. Inspection technologies


were also a major focus. PARMI demonstrated how AI-powered inspection platforms can reduce programming times from hours to minutes while maintaining high levels of accuracy. In one live demonstration, an unfamil- iar PCB was programmed for in- spection in approximately five minutes, showcasing the grow- ing role of artificial intelligence in streamlining production setup and debugging.


Process Innovation Across the Factory Floor


Essemtec’s presentations fo-


Technica Tech Day attendees gather around a live ASMPT SIPLACE demonstration at


Technica’s San Jose Demo & Applications Center.


by emphasizing the value of face- to-face collaboration and techni- cal engagement. “These events were a corner-


stone of how we connected with our customers in the past, only to be disrupted for a period of time due to COVID and the pause everyone took before returning to larger gatherings,” said Perry. “We are fully focused on deliver- ing meaningful technical value through in-person collaboration.” The event began with an in-


Level up coating


while using less material. Conashield™ CS-313 Flood Coating


troduction to NextFlex, the ad- vanced manufacturing institute dedicated to strengthening U.S. leadership in hybrid electronics manufacturing through collabo- ration between industry, acade- mia, government, and defense organizations.


Addressing the Demands of AI Hardware


A recurring theme through-


out the event was the impact AI and high-performance comput- ing systems are having on elec- tronics manufacturing processes. Presentations from ASMPT


highlighted the increasing com- plexity of AI server hardware, which often incorporates ex- tremely large and heavy BGAs, dense component layouts, and oversized circuit boards. These assemblies present significant challenges for placement accura- cy, inspection, and process relia- bility.


Reduced material costs Excellent coverage High reproducibility


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During live demonstrations,


attendees observed advanced placement technologies capable of inspecting PCB spacers, veri- fying solder-ball integrity, meas- uring package warpage, and ac- curately placing BGAs weighing hundreds of grams and contain-


cused on precision dispensing, placement, and BGA reballing applications. As component val- ues continue to rise and package complexity increases, manufac- turers are looking for ways to re- cover and rework expensive de- vices rather than scrap them. Demonstrations showed how ad- vanced automation platforms can improve yields while reduc- ing component waste.


AI-driven hardware is pushing SMT placement, inspection, and process control technologies into entirely new territory.


The event also featured an


in-depth discussion of X-ray in- spection challenges associated with modern AI hardware. Cre- ative Electron CEO Bill Cardoso explored the difficulties of in- specting increasingly complex packages with ultra-fine-pitch interconnects, heavy copper structures, and advanced ther- mal materials. Live demonstra- tions showcased high-resolution 2D and 3D X-ray technologies designed to identify hidden de- fects while maintaining produc- tion throughput.


Expanding the Technology Ecosystem


Beyond placement and in-


spection, attendees were intro- duced to a range of complemen- tary technologies designed to im- prove manufacturing efficiency. Inovaxe demonstrated ma-


terial management solutions aimed at optimizing inventory control and reducing labor re-


Continued on next page


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