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www.us - tech.com


July 2026


Manncorp Eliminates Stencils and


Secondary Equipment with New Integrated Jet Dispenser for SMT Pick and Place Lineup


By Chris Ellis, Sales & Operations Manager, Manncorp


integrated jet dispenser designed to fit directly within its MC series pick- and-place platforms. Developed for high-mix, low-volume manufacturers and prototyping environments, the system eliminates the need for SMT stencils and removes the requirement for a separate standalone dispensing machine.


M Traditional stencil printing can


create significant challenges for man- ufacturers producing frequent prod- uct changes and small batch runs, re- sulting in recurring tooling costs and increased lead times. While stand- alone jet printers offer an alternative, they often require additional floor space, capital investment, and sepa- rate programming environments. Manncorp’s new approach embeds jet dispensing directly into the placement process, allowing solder paste deposi-


anncorp, a provider of elec- tronics assembly turnkey so- lutions, has introduced a new


tion and component placement to be performed on a single platform.


Compatibility The jet dispenser is compatible


with Manncorp’s new MC410 pick- and-place system, as well as the MC385, MC392, MC389, and MC388 models, supporting placement speeds of up to 10,500 components per hour. By combining dispensing and place- ment into a unified workflow, manu- facturers can program, dispense, and populate assemblies using one ma- chine. The dispenser is capable of de- positing up to 640 solder paste dots per minute with high repeatability, enabling rapid transitions from de- sign to production. To simplify the complexities


Jet dispenser integrated into pick-and-place platform.


often associated with jet dispensing, Manncorp has partnered with Inven- tec Performance Chemicals to opti- mize the dispenser around specific solder paste formulations. The collaboration aligns the me-


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chanical characteristics of the dispensing system with the rheological properties of Inventec’s solder pastes, helping to achieve consistent dot geometry while reducing the potential for splatter and clogging. As part of the launch, customers purchasing a Manncorp Jet Dis- penser will receive a complimentary tube of Inventec solder paste. Manncorp also continues to support conventional stencil-print-


ing processes. Customers purchasing a standard stencil printer will receive a complimentary 250g jar of Inventec’s ECOREL 305- 16LVD 88.0T4 solder paste for evaluation in traditional production environments.


Two Configurations The new technology is available in two application-specific con-


figurations. The Jet Dispense 1 system, paired with Inventec T6 sol- der paste, is optimized for component pitches down to 0.5 mm and 0402 devices, producing dot sizes as small as 280 µm. The Jet Dis- pense 2 configuration, using In- ventec T7 solder paste, supports pitches down to 0.4 mm and 0201 components, delivering dot sizes as small as 200 µm while main- taining high-speed dispensing performance. By integrating jet dispensing


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directly into its placement plat- forms, Manncorp provides manu- facturers with a compact, turnkey solution that reduces equipment requirements, saves floor space, and increases produc- tion flexibility. The company says the system is designed to help electronics


manufacturers


streamline operations while maintaining the precision re- quired for today’s increasingly


complex assemblies. Contact: Manncorp, 3615


Davisville Road, Hatboro, PA 19040 % 215-830-1200 E-mail: sales@manncorp.com Web: www.manncorp.com r


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