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eliminates many problems associated with alternative unstructured techniques to provide leading edge performance. The solver provides an innovative and efficient way to solve Navier-Stokes equations and, significantly, also means that the user no longer has to undertake the task of manually optimising the grid. Beginning with a fine grid over the

entire model, a hierarchy of Cartesian grids of increasing coarseness is constructed, and the solver chooses only those cells required to resolve the geometry. This ensures that large areas are treated at a suitable level of resolution for grids that do not call for a high level of detail, but still allows the tool to apply a finer grid to smaller objects. The 6SigmaET solver retains the

simplicity of staggered grids to avoid some of the damaging interpolation that is usually required, making it superior to a number of the unstructured solvers currently available. 6SigmaET also includes a broad array

of intelligent modelling objects including PCBs, chip sockets and electronic components. It can, for instance, model semiconductor devices – either imported from CAD models or configured parametrically – to deliver an accurate prediction of junction temperatures, as well as allowing for the inclusion and analysis of complex heat sink and enclosure designs. Enhancements have also been made

to the user interface and functionality. A new object panel displays all the intelligent modelling objects that are available, and these can be dragged and dropped into the model. The latest version of 6SigmaET also substitutes the menus and toolbars of previous generation products with

everything we know about electronics, each

time we assemble electronics in a new way it’s something of an adventure into the unknown, and this is where the risk lies”

Thermal modelling tools enable the designer to develop a solid

understanding of how temperature is distributed in a given design

a familiar ribbon-based, context-sensitive user interface. Automated revision control is featured, as is design-timeline tracking to allow design variations to be organised and design variations and progress from concept to production to be tracked.

PROVIDING VISIBILITY Discovering and optimising the heat

characteristics of a new product can, of course, still be done the old-fashioned way – by building a prototype, testing it, building another one, testing it. Eventually, the risk will likely be either eliminated, mitigated or minimised. The problem today is that time and budget are commodities in very short supply. Michael Eisner, another famous

American, was CEO of Disney for 20 years. According to him: “When you’re trying to create things that are new, you have to be prepared to be on the edge of risk”. The challenge in electronics design is to be able to see that edge ahead of time. Thermal simulation provides the necessary visibility.

Future Facilities Enter 220

Enter 14

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