FEATURE FASTENINGS & ADHESIVES E
llsworth Adhesives supplies solutions to almost all of the industrial
markets – including aerospace, military, construction, white goods, and LEDs and lighting. It does, however, know the electronics industry more intimately than most. In fact many of the manufacturers that Ellsworth Adhesives represents, including Henkel, Dow Corning and Robnor Resins, have product ranges specifically designed for this sector. Henkel, for example, produces solutions for the electronics industry, including semiconductor packaging, printed circuit board (PCB) assembly and advanced soldering solutions. There are hundreds of different ways in which its electronic adhesives can enhance the quality and efficiency of electronic components. The Technomelt range, for example,
provides protective encapsulation for electronic components, making it the perfect adhesive for low-pressure moulding applications. This is an innovative hot melt adhesive that both bonds and protects. In the low-pressure moulding process, the components are placed without a housing in a mould and encapsulated with the hotmelt. Once the moulding has cooled and solidified, the components – now provided with a protective outer shell – are ready for further processing. Hotmelt moulding uses one-part adhesives, resulting in a simple, very fast and clean production process. The low application pressure ensures that the process is gentle and therefore suitable for encapsulating even small and delicate components with a hotmelt adhesive. Dow Corning, meanwhile, also has a portfolio of adhesives tailored to suit the specific requirements of the electronics market. A key benefit of its adhesives is their potential to significantly increase reliability of the electronic module or component because of their stress- relieving properties. The adhesives have a ‘rubbery’, elastomeric nature rather than being traditional, highly rigid, adhesives. This low stress environment can reduce damage to module components and interconnections. The company manufactures a variety
of non-corrosive, thermally conductive silicone adhesives that are suitable for bonding hybrid circuit substrates, power semiconductor components and devices to heat sinks, as well as for other bonding applications where flexibility and thermal conductivity are major concerns. The flowable versions can also be used as thermally conductive potting materials for transformers, power supplies, coils and other electronic devices that require improved thermal dissipation. Launched last year, TC-2030 from Dow
10 MAY 2015 | DESIGN SOLUTIONS
STICKING WITH the electronics industry
As a global corporation specialising in the distribution of adhesive related products, specialty chemicals and dispensing equipment, the application engineers at Ellsworth Adhesives have many years of experience in problem solving and implementing adhesive solutions in the manufacturing environment. Here, the company looks into the use of adhesives in the electronics industry
Corning offers outstanding thermal conductivity and excellent elastomeric properties after ageing, providing long-term reliability. Good adhesion to various substrates, such as anodised or cast aluminium, tin-plated copper and printed circuit boards, make this material well suited for use across a wide variety of electronics markets. This has a thermal conductivity of 2.7 W/mK, which is higher than traditional thermally conductive adhesives. And with a viscosity of 190 Pa.s, it also offers good dispensing characteristics and can be easily applied by a dispenser once the two-part formulation is mixed. The electronics market has shown a need for improved heat dissipation in printed circuit board applications with high power components, and TC-2030 provides manufacturers with a viable option to address this need.
EPOXY SOLUTIONS Moving from silicone adhesives to epoxies and we turn to Robnor Resins, which produces epoxies for electronic and electrical applications requiring the highest protection in the toughest environments – such as deep sea, engine management, space and chemical plant equipment. As an alternative to polyurethanes and silicones, the epoxies
TC-2030 from Dow Corning offers thermal conductivity and elastomeric properties after ageing, providing long-term reliability
offer significantly enhanced adhesion and mechanical support while providing thermal transfer, chemical resistance, insulation and dimensional stability. Formulated to meet international standards, these can be modified to suit specific applications. One of the most common applications is potting for electronic devices. Robnor ELP199HP, for example, is being used by a smart metering solutions provider for potting its electronic RFID transmitting data devices in mechanical water metering systems. The adhesive provides a low cost
integral solution with resin and dispensing equipment thanks to its low viscosity, low hardness and high flexibility. It also offers good adhesion to ABS and FR4 and is UL94-VO compliant. The sales engineers at Ellsworth could
fill a whole series of books with their knowledge of adhesives and industrial applications - this small snapshot of their experience in the electronics industry is just the tip of the iceberg!
Robnor ELP199HP epoxy is used for potting electronic devices
Ellsworth Adhesives
www.ellsworthadhesives.co.uk Enter 203
/ DESIGNSOLUTIONS
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