NEWS // FEATURES // NEW PRODUCTS
Microsemi Announces Availability of Intrinsic-ID’s Security IP on its Flash- based cSoCs, FPGAs and Development Boards
Customers Benefi t from Entire Suite of Additional Security Applications Microsemi Corporation
(Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the immediate availability of Intrinsic-ID’sQuiddikeyTM security intellectual property (IP) on its fl ash- based devices and development board including the SmartFusion® customizable system-on-chip (cSoC), as well as ProASIC®3, IGLOO® and Fusion FPGAs. Intrinsic-ID’s security QuiddikeyTM
IP includes the company’s patented physical unclonable function (PUF) technology, enabling an added level of security in secure government applications as well as in commercial markets including the fi nancial, energy, automotive and mobile industries. “Integrating Intrinsic-ID’s physically unclonable function IP with our ProASIC®3 and other fl ash FPGAs allows our customers to deliver more secure products with simpler key management requirements,” said Rich Kapusta, vice president terrestrial products, SoC Products Group at Microsemi. “In addition, it allows them to accelerate the design of secure embedded products, which can provide their organizations with a competitive edge.”
Plasma Etch Introduces the MK11-O printed Circuit Board Plasma System
MK11-OPlasma Etch, Inc has introduced a low cost printed circuit board plasma system utilizing two key technological patents developed by Plasma Etch, Inc that when combined, simply put, produce superior results, the fastest etch rates and cycle times.
September 2011 Security solutions for embedded
applications rely on a secret key to guard secure data. Intrinsic-ID’s PUF technology extracts a unique secret key directly from the cSoC and FPGA’s silicon hardware, as opposed to other solutions that require loading an externally generated key in on- chip non-volatile or battery-backed memory. This unique approach works like
an electronic fi ngerprint, allowing the device to generate a secret key only when required. As a result, tampering and cloning are made extremely diffi cult. Attackers have nothing to fi nd because no key is stored and the key is not present in the power down state. “Security demands of electronic
systems are undergoing a tectonic shift,” said Tony Picard, vice president business development at Intrinsic-ID. “The trend to application convergence and Internet connectivity fuels the requirements to substantially raise the level of security in many electronic systems today. We’re pleased to offer Microsemi and its customers solutions that meet the need for increased security requirements.” Intrinsic-ID’s Quiddikey security
intellectual property cores are available now for ordering. For more information on
Microsemi’s SoC products visit:
www.microsemi.com/soc .
The MK11-O is the ideal
solution for desmear and etchback applications. The MK11-0 has the technological advantage of offering the unique combination of process temperature control and electrostatic shielding both working in harmony to produce the most consistent, most uniform, most reliable etch rates obtainable across
an entire boards surface. Plasma Etch agrees and so will you, this is what
Omnetics Hybrid Micro/Nano Connector designed to save space
Omnetics Connector Corporation, the leading manufacturer of miniature high-rel connectors, has a hybrid Micro/Nano Connector designed to reduce weight and space while meeting design requirements. By combining a standard nano (.64 mm pitch) and a standard micro (1.27 mm pitch) insulators and contacts in a CNC machined metal shell the engineer is able to combine power and signal processing in a compact area. The nano contacts can carry up to 1 amp per contact while the micro contacts can handle 3 amps. These nano and micro pins and sockets are the same as those that are used in our QPL qualifi ed MIL-DTL-32139 and MIL- DTL-83513 connectors ensuring the utmost reliability and quality. Comments Greg Jones North
American Sales Manager: “Omnetics is constantly being asked for creative ways to reduce size and weight. By combining two connectors into one metal shell we manage to accomplish our goal. Omnetics’ engineering works closely with design engineers to create unique solutions, whether it is combining connectors or designing a cable harness. Utilizing 3-D modeling, design time is signifi cantly reduced and the end product is one the design engineer can trust to be correct”.
it’s all about, the best end results. We invite all PCB manufactures and all technical gurus to check this system out.
For more information please visit
www.plasmaetch.com or call (775) 883-1336.
www.electronicscomponentworld.com /
www.electronicproductionworld.com EIU 45
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