Feature: Wireless technology
Advancing packaging technologies for 5G and 6G
By Dr Yu-Han Chang, Senior Technology Analyst, IDTechEx
M
illimeter-wave (mmWave) technology, previously confined to military, satellite
and automotive radar applications, has now entered the consumer systems spectrum, offering throughput of 20Gbps with 1ms latency. This shift calls for innovative technological advancements across various small devices, including RF and optical components, low-loss materials and advanced semiconductor packaging, which is seen as a crucial area for development. It is also the key focus of IDTechEx’s latest report “Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets”.
AiP technology Antenna-in-package is typically found in high-frequency telecommunications. Leveraging the short wavelengths of
Figure 1: Overview of antenna packaging technologies vs operational frequency
mmWave applications, AiP allows building smaller antennas that can seamlessly be integrated directly into semiconductor packages – unlike traditional discrete antennas assembled as individual components on a PCB. This integration of antenna and transceiver on a single chip offers many advantages, including better antenna performance and a smaller footprint. The next step is to integrate antennas
directly onto RF components; see Figure 1. However, this area is still in its research phase due to various manufacturing and scaleability challenges.
Key design AiP considerations With AiP technology, cost-effectiveness is a crucial consideration. With a target price of $2 per 1x1 AiP module, affordability becomes pivotal for its widespread adoption. Using cost- effective packaging materials and processes is essential. Additionally, miniaturisation plays a critical role, especially for antenna integration into consumer devices like smartphones, where component size is paramount. Moreover, achieving high performance
is vital for AiP platforms. This entails the fabrication and integration of high- gain, broadband mmWave antenna arrays, along with ensuring intra- system electromagnetic compatibility. Additionally, optimising equivalent isotropic radiated power and ensuring
62 July/August 2024
www.electronicsworld.co.uk
signal and power integrity are of great importance, too. Furthermore, guaranteeing direct thermal passage from the chip to the exterior, to dissipate heat from power amplifier, is also of crucial importance, especially in smaller systems. Scaleability adds another layer of
versatility, enabling the design of basic modules that can be upscaled to meet different power needs. Addressing all these requirements is
essential when designing an AiP module for high-frequency communication devices. Questions like the choice of antenna element, substrate technology and materials, integration of passive devices, as well as supply chain maturity are all explored in IDTechEx’s report.
Future trends In “Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets”, IDTechEx delves into AiP technologies tailored for 5G mmWave and emerging 6G networks. It analyses substrate technologies, including organic, LTCC and glass, and packaging methods like flip-chip and fan-out, from material properties to manufacturing feasibility. The report explores antenna
integration beyond 100GHz, offering case studies and addressing prevalent challenges, projecting a future driven by advanced semiconductor packaging solutions.
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72
