Technology


ASMPT addresses the needs of the automotive sector ASMPT also presented innovative laser dicing and sintering


Te automotive industry stands to gain from ASMPT’s new- generation power modules, exhibited recently at the PCIM Europe event in Nuremberg, Germany. Tey are based on silicon carbide (SiC), a material that offers high efficiency and excellent thermal conductivity. Firmly bonded to heatsinks via silver sintering, ASMPT have made them highly applicable to the power electronics needs of the automotive sector, as well as other industries.


ASMPT at the PCIM event


technologies at the PCIM Europe industry fair, addressing the current challenges in the production of power electronics. However, to adhere to its sustainability strategy, ASMPT didn’t ship giant machines to Nuremberg, but instead presented its machines in the form of models, along with 3D videos; see image leſt. In addition to the process chain for power modules, AMPT’s


presented its ALSI LASER1205 multi-beam laser dicing platform, which shows significantly improved yield in the separation of thin, sensitive and very expensive SiC wafers. Te innovative system processes wafers ranging from 10-250μm in thickness, with a positioning accuracy of less than 1.5μm, yet it operates 50% faster than conventional methods. “Against the backdrop of recent supply chain challenges, the


European automobile electronics industry has a great interest in having more chips and components made in Europe. Power electronics companies in particular are developing great momentum, as was apparent at the PCIM show,” says Johann Weinhändler, Managing Director at ASMPT AMICRA in Regensburg, Germany, who is responsible for ASMPT’s Semiconductor Solutions segment in EMEA. “With our help, European EMS providers will conquer new business areas.”


CEA-Leti breakthrough will deliver AI-embedded CMOS image sensors


CEA-Leti scientists have created a new generation of CMOS image sensors with embedded AI that allows an image they ‘see’ to be understood within the content of the scene and trigger a reaction if required. “Stacking multiple dies to create 3D architectures, such as three-


layer imagers, has led to a new trend in sensor design,” said Renan Bouis, a scientist at CEA-Leti. “But, communication between the different tiers requires advanced interconnection technologies, a need that hybrid bonding meets because of its very fine pitch in the micro- and sub-micrometer range. High-density through- silicon via (HD TSV) has a similar density that enables signal transmission through the middle tiers. Both technologies contribute to the reduction of wire length – a critical factor in enhancing the performance of 3D-stacked architectures.” Te CEA-Leti team developed a three-layer test vehicle with two


embedded Cu-Cu hybrid-bonding interfaces, face-to-face (F2F) and face-to-back (F2B), and with one wafer containing high-density TSVs. Tis test vehicle is considered a key milestone, because it demonstrates the feasibility of each technological step and the integration process. Te team also managed to reduce the devices’ resistance by 40%. “Combining hybrid bonding with HD TSVs in CMOS image


sensors could facilitate the integration of various components, such as image sensor arrays, signal processing circuits and memory


FIB-SEM 3D cross-section of the entire test vehicle structure - pitch is 6μm for the hybrid bonding pads and HD TSV dimension is 1 x 10μm


elements, with precision and compactness,” said Stéphane Nicolas, a CEA-Leti scientist. Demand for smart sensors is growing tremendously, in industrial,


consumer, home, smart city and buildings, automotive and more applications. Embedding AI into such sensors, like CEA-Leti did, will be a major enabler in those applications.


www.electronicsworld.co.uk July/August 2024 05


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