Feature: Embedded


The conga-MA7 module


embedded system. It provides a set of routines that allow the operating system to interface with the hardware, including device drivers, memory management and interrupt handling. T e BSP also provides board-specifi c information, which is data-specifi c to the hardware platform. T is information includes the memory map, I/O mapping and interrupt routing.


AI and 3D machine vision While sensor fusion keeps robots more accurate, leveraging artifi cial intelligence (AI) can help make robots intelligent. Incorporating AI into robotic systems can help enable them to intelligently perceive, make decisions and perform tasks. A robot with AI capabilities can intelligently detect and recognise an object and its position, and take action accordingly. For example, Congatec has several modules suitable for


developing these industrial applications, including robots: • Conga-MA7: COM Express Mini Type 10 module based on Intel Atom x6000E, Intel Pentium and Celeron J processor series.


• Conga-TC570: COM Express Type 6 Compact module based on 11th Gen Intel Core processor family (code name “Tiger Lake”) and soldered-down memory.


• Conga-TCA7: COM Express Type 6 Compact based on Intel Atom x6000E, Intel Pentium and Celeron J processor series. Congatec’s COM Express modules provide the necessary


The conga-tc570r module


performance scaleability from Intel’s low-power to high-end processors. Combining Intel’s heterogeneous processor technology with its OpenVINO AI toolkit off ers deep-learning models, device portability and higher inferencing performance with fewer code changes, to accelerate AI application development.


www.electronicsworld.co.uk December/January 2023 25


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