Soft-switching pioneer, Pre-Switch, launches CleanWave 200kW SiC inverter evaluation system demonstrating increased EV efficiency and range, plus reduced battery size and weight AI-based solution to hidden inverter challenges also suits Solar, Wind & Traction applications above 100kW

Pre-Switch, Inc., the Silicon Valley start-up that is delivering soft switching for DC/AC and AC/DC power conversion, has announced its CleanWave 200kW silicon carbide (SiC) automotive inverter evaluation system that enables power design engineers to investigate the accuracy of the company’s soft switching architecture and platform over varying load, temperature, device tolerance and degradation conditions.

Pre-Switch’s platform, including the Pre-Drive™3 controller board, powered by the Pre-Flex™ FPGA, and RPG gate driver board, virtually eliminates switching losses, enabling fast switching at 100kHz, significantly improving low torque motor efficiency. High switching frequency also reduces motor copper and iron losses. For electric vehicles this results in a massive increase in range of 5-12%. The soft- switching solution also benefits industrial motors, solar, wind and traction applications or any other power converter requirement greater than 100kW that is looking to reduce costs and improve efficiency.

Pre-Switch’s forced-resonant soft-switching topology replaces the traditional IGBT driver or silicon carbide driver with a common intelligent controller board, Pre-Drive3, and a specific plug-in RPG (Resonant Power Gate) module optimized for the customer’s chosen SiC or IGBT package. The Pre- Switch architecture increases efficiency and range, while reducing size and weight. A new video explaining the technology and its application to EVs is available at:

Lattice Semiconductor announces design wins with Pioneer & Onkyo Corporation for Prosumer A/V Home

Entertainment Receiver Systems Pioneer Selects Lattice SiI9437 Receiver IC for Enhanced Audio Return Channel (eARC) HDMI®

2.1 Capabilities

Lattice Semiconductor (NASDAQ: LSCC), a leading provider of customisable smart connectivity solutions, today announced that Pioneer & Onkyo Corporation has selected the Lattice HDMI eARC Receiver IC to provide “eARC” features for its Pioneer Elite 7.2 channel SC-LX502 and Elite 9.2 channel VSX-LX503 home A/V receivers (AVR), which provide multiple wired and wireless connectivity options for audio, video and gaming components.

“Adding HDMI eARC to our cutting-edge Elite line of A/V receivers gives our customers a forward-compatible home theater solution, designed to support enhanced 4K and 8K televisions of the future,” said Akira Takahashi, Director of Pioneer & Onkyo Corporation. “With HDMI eARC, our A/V Receiver can play surround-sound audio, including high-bitrate audio, from the television’s built-in streaming apps, as well as from devices attached directly to the TV.”

“We are pleased that Pioneer selected the Lattice eARC ICs to help them deliver an uncompromised A/V experience to consumers,” said Marshall Goldberg, Product Marketing Manager, Lattice Semiconductor. “Lattice worked with leading companies to develop eARC to prevent forward-compatibility issues as the HDMI standard evolves. Our eARC ICs are designed to work with any existing HDMI transmitter or receiver IC and any version of HDMI. They are part of Lattice’s comprehensive portfolio of low-power FPGAs and connectivity ASSPs designed to make prosumer A/V products smarter, sleeker and longer lasting.”

New 10W reed relay from Pickering Electronics reed relay range; suits high speed test systems

suits high-PCB-density applications Extends 4mm2TM

Pickering Electronics, the reed relay company which has pioneered miniaturization and high performance for over 50 years, has added a new 10W-rated reed relay to its successful 4mm2TM

product family which

features devices that occupy a PCB footprint of only 4mm x 4mm, facilitating the highest packing density currently available. Series 122 relays measure 12.5mm in height and are rated with a switching current of 0.5A at 10W. 3V and 5V coils are available.

Fast operate and release times, typically 150µs or less, make Series 122 relays ideal for high speed test

systems such as A.T.E. switching matrices or multiplexers. The 1 Form A (SPST) Normally Open (NO) Energize-to-make devices feature highest-quality, instrumentation-grade sputtered- ruthenium switches and plastic packages with internal mu-metal magnetic screening to avoid the risk of magnetic interaction issues in densely-packed applications. Devices have an insulation resistance of greater than 1012 and are 100%-tested for dynamic contact resistance to guarantee performance.

For ease of servicing/replacement, relays maybe socketed using SMD or through-hole sockets. However, care must be taken to mitigate the risk of affecting contact resistance integrity.

New high performance 200A current sense transducer for OEM applications from Danisense is 40% lower cost than competition ‘High accuracy has never been so accessible’

Danisense, the leader in high-accuracy current transducers for demanding applications, today announced the DC200IF, a highly accurate, highly- stable 200A current transducer targeting system integration OEM applications, that is around 40% lower cost than competing models. This enables users to access Danisense’s unique, double-core, balanced flux gate measurement technology, at a very affordable price/performance ratio.

The DC200IF boasts excellent linearity (6 ppm) with a maximum offset of 5ppm, equivalent to 1.5mA. The units provide DC and AC current metering with +/- 0.1 absolute accuracy up to 5kHz. Devices feature low noise and high immunity to EMC. DC200IF current transducers are compact and are supplied with four industry-standard 6.3 x 0.8mm Faston connections.

The new, low cost DC200IF current transducers boost the performances of OEM power converters for medical, precise power supply, battery charger and accurate motor drives applications. Key applications include MRI equipment, power supplies for magnetic fields in particle accelerator and hadron therapy equipment, variable frequency drives, battery charger metering and monitoring. OMC adds new dust-proof FDH1M SMA bulkhead receptacle

to range of advanced fibre optic connector systems Robust design with integrated dust seal ensures signal integrity in materials processing applications and high dust environments

OMC, the pioneer in optoelectronics design & manufacture, has announced a new receptacle for its range of fibre optic receiver and transmitter diodes. On display for the first time on Stand L30 at the Electronics Design Show, the new FDH1M SMA housing with integrated dust seal is an enhanced version of OMC’s popular FDH1 SMA bulkhead housing and is designed to protect signal integrity in fibre optic links in dust or powder contaminated environments, such as materials processing plants.

The FDH1M housing is a rugged, all-metal design with square base flange, featuring mounting holes in each corner to bolt down to the bulkhead, securing it firmly and helping to resist vibration and strain. As well as being far more robust than plastic housings, the all-metal construction of the FDH1M also helps screen the active device against radio frequency interference.

The new FDH1M SMA bulkhead receptacle is precision-machined and assembled in OMC’s purpose-built facility in the UK, and is available with a range of transmitter and receiver diodes aligned and housed within to form a dust-resistant transmitter or receiver module. The company’s engineering team has over 30 years of experience in the design of fibre optic datalinks and components, and specialises in tailoring their solutions to meet a customer’s bespoke requirements.

Panasonic Industry announces sponsorship and collaboration on future transportation programmes with Eindhoven

University of Technology and Technical University of Munich Financial support, know-how and resources committed to European student projects to expand possibilities and explore sustainable alternatives

Panasonic Industry Europe (PIEU), the European partner for electronic components, devices, modules and solutions in the industrial sector, today announced a collaborative sponsorship agreement with Technical University of Munich and Eindhoven University of Technology, both internationally recognized institutions of higher education and research in the field of engineering. The cooperation encompasses four mobility projects, all addressing frictionless, automated and sustainable answers for tomorrow’s transportation. The one-year sponsorship grants almost €100k in financial support and importantly enables the teams to benefit from Panasonic Industry’s components and know-how. Both vital factors to the education of scientists and engineers and to the development of technologies that can significantly make a better life and a better world.

Johannes Spatz, President at Panasonic Industry Europe: “Our society stands on the brink of a technological revolution that will fundamentally alter the way we travel and how we perceive transportation. In particular, the technological changes associated with ACES transformation – Autonomous, Connected, Electric and Shared vehicles – will create vast opportunities. At Panasonic Industry we are excited about new possibilities and opportunities which lie ahead of us and our scientific research collaborations give us the opportunity to share our natural curiosity with young and smart heads as well as to share our enthusiasm for connected mobility and our products. We are always surprised when we expand our horizons with ambitious and motivated students: there is a lot of creative and visionary potential we want to promote, support and nourish”.

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