Round flat round – the key to vibration resistant PCB to PCB interconnectivity

Hitaltech explains how taking a fresh approach to the standard wire helped create better vibration resistance and stronger connection points.

You might not imagine there’s too much innovation to be found in the humble wire. And yet the standard round wire has always presented a problem for applications subject to vibration. If the cables that connect your PCBs can’t withstand the heat and vibration inherent in the application, as is the case, for example, in washing machines or the automotive sector, those connections become fragile.

Yet round wires have never made the most flexible of connectors. Flat has always been more flexible. But create a purely flat wire and you place stress on solder joints and risk weaker connection points.

So Hitaltech has taken the best facets of both wires to create a connector that offers flexibility, vibration resistance and connection strength, in a technology they call ‘round-flat-round’.

Production benefits

The flattened connectors deliver surprising production advantages, as Hitaltech MD Andy Fitzer is keen to emphasise. “The flexibility of the connectors gives designers so many more options when developing products. You can take a flat panel PCB, break it up and stack it in sections, or fold panel at 90 degrees. So a round-flat-round connector isn’t just a benefit to vibration or connection strength. It can play an active part in miniaturisation, design freedom and cost effectiveness too.

To explore applications for round-flat-round connectors in your products, contact

Hitaltech UK Ltd

Northern Manufacturing & Electronics

Northern Manufacturing & Electronics, the North’s top industrial technology show, returns to EventCity, Manchester on October 2nd and 3rd 2019. If you’re involved in electronics, engineering or manufacturing, this is one show not to miss. The free-to-attend event delivers an impressive selection of top vendors covering production, test, consumables and a full range of subcontract services from PCB production to full CEMS solutions. There is a huge range of components on show, both

electronic and mechanical, including custom-made plastic parts, enclosures, connectors and sub-assemblies such as power supplies and ruggedised data storage devices. There’s also live demonstrations of the latest production technologies, including machining centres, 3D printing, laser and EDM machines; Production equipment highlighted includes everything from ERP software, stock management systems, storage, labelling and much more. There’s also business support services and a great free seminar programme too. Find out more and book your free tickets at: German component distribution defies

ailing market In the first quarter 2019 the turnover of companies organised in the Professional Association of Component Distribution (Fachverband Bauelemente-Distribution, FBDi e.V.) grew by 4% to around 922 million euros. However, orders dropped by close to 17% to 832 million euros, which equates to a book-to-bill ratio of 0.9.

In the large product segments, growth in passive components continued at an above- average rate with 21.4% (to

German component distribution (according to FBDi e.V.) is up 4% in the first quarter of 2019

114 million euros), followed by semiconductors, which were up by 3.5% to 664 million euros. All other product areas, including electromechanics (-4.1% to 89 million euros), were down. As a result, there was a slight shift in favour of passive components (12%) and semiconductors (72%) in terms of the percentage share of the overall market. Electromechanics held its 10% share, while all other segments combined to 6%.

Advanced Interconnections low stack height Mezza-pede®

SMT Connector

Advanced Interconnections’ newest Mezza-pede®

SMT Connector, low

profile model DHAL, reduces board stack height by 15%. When paired with the mating socket, a z-axis stack height of 0.132 in. (3.4mm) is achievable – providing a reduction in package height and a shorter signal path in datacom and networking applications.

Advanced Interconnections Corporation USA Tel: 1 (401) 823-5200 Email:

New finger shaped heatsinks

More frequently power semiconductors are not handled separately from control and signal processing, but directly used on the functional PCB. The heat loss of those devices is not trivial at all and therefore needs efficient concepts for heat dissipation. The known cooling concepts are the traditionally used heatsinks which are mounted to the electronic devices and thus cools those precisely. Furthermore a simple, secure and fast mounting of the heatsinks to the device to be cooled is demanded beside the efficient heat dissipation. Specially for this type of heat dissipation of electronic devices on the PCB company Fischer Elektronik extends their wide product portfolio by altogether 72 different versions of finger shaped heatsinks. As a synonym for the term finger shaped heatsink the term “board level heatsink” was manifested among experts. The board level heatsinks of series FK 259 up to FK 282 are made of highly heat conducting copper material. The

fundamental structure consists of a base plate which simultaneously presents the contact area of the device and is therefore connected to the device to be cooled. Distantly and connected to this contact area the straight or angled cooling tabs form the overall geometry. A thermotechnical optimal connection and mounting of the device takes place by retaining clips which are already integrated in the production process which assures an optimal heat transfer between the electrical device and the finger shaped heatsink by using a high contact pressure. For solder mounting the board level heatsink to the PCB, also integrated solder pins are available for the horizontal or vertical mounting whereby the total package heatsink/device is mounted to the PCB and additionally mechanically stabilized. The solderable surface coating of the new designs is done according to the EC directive RoHS and guarantees an excellent solderability for wave and reflow soldering. The new board level heatsinks of the series FK 259 up to FK 282 are, depending on the performance class, thermally matched to the most popular transistor designs, such as TO 220 up to TO 247 as well as SIP Multiwatt and several more and allow excellent possibilities for heat dissipation on smallest mounting space.

Further modifications and special designs are realised according to customer specifications.

Please contact us, for further information and inquiries the product experts of Fischer Elektronik are pleased to be at your disposal, also at:

Automatic identification with ELATEC RFID readers

Devices using RFID technology for identification are widely used in warehouse logistics, shipping and management. A large number of available solutions and a frequent need to integrate them into a single, coherent system can be problematic and time-consuming. Solutions offered by Elatec allow you to reduce costs and time that are necessary to integrate new solutions into the existing systems.

Auto ID solutions with Elatec RFID readers

The rapidly growing market of RFID and wireless communication systems poses new challenges to hardware manufacturers and solution integrators who offer Auto ID products. Regardless of the area of application, the key element is the choice of the right RFID technology for proximity identification. It is of crucial importance, as many different RFID standards operate in parallel. In this way, often used RFID technologies differ in standard from the newly introduced solution. An example of such a problem can be an office building, where RFID technology is used to control access of employees. At some point, there is a need for systemically integrated access of employees to printers equipped with RFID readers installed in the building. Let us assume that the readers used in printers work in a different standard from that used for access control. This situation forces the employees to use two cards – one allowing access to the workplace and the other – for identification purposes in the printer. Universal Elatec RFID readers and modules eliminate this inconvenience by offering support for the vast majority of currently used RFID technologies. This applies to both low frequency (LF) 125/134.2 kHz and high frequency (HF) 13.56 MHz communications.

Tel: +48 42 645 54 44

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