FEATURE ELECTRON


NICS FOR HARSH ENVIRONME


ENTS Per


Performance b o o s t i n e m b e d d e d t e c h n o l o gy for ha r s h e n v i r o n m e n t s


SIZE M rformance boo


Server processo them to boost p application-rea


SIZE M A T T E R S N O T for h a rsh environm ents


MATTERS ost in embedd


rs are getting more energy efficien performance. Zeljko Lo dy COM Express Type


nergy efficient, as em oncaric, marketing dir e 7 modules and platfo


S NOT ded technolog


g y


bedded application de rector at


Congatec, dis orms contribute to this tren


ARMED AND READY READY SERVER-ON Congatec has now m


evelopers use scusses how is trend


EPYC Embedded 3000 processor series available on COM Express T


Y: APPLICATION- N-MODULES made the AMD 00 processor series


on-Modules. This form factor standard convinces with its dimensions of 125 x 95mm, currently support


xpress Type 7 Server- orm factor standard mensions of 125 x


of onboard data as well as 4x 10 GbE and up to 32 PCIe Gen 3 Customers are rew ll d


pport ing up t o 96 GB well as 4x 10 GbE and lanes.


extremely small and l


server-on-module that includes all drivers, practice designs and guidelines to allow efficient im


embedded server designs in a small form factor.


For those who want to use even more interfaces or im


nt to use even T


he embedded comput is demanding more co power across many applic As Industry 4.0 cements i


s itself, its


ing market omputing cation areas. tself, its


applications require sy nchronisation of multiple machines and systems in order to maintain maximum product ivit y; machine vision in collaborative and cooperative robotics requires processing of environment al data, as


wit h autonomous robotic and logistics vehicles. Moreover, many of the edge computing tasks that arise around the development of 5G networks require


server class performance by default. As h h k


such, the market must provide a boost in server processor performance in order to meet t hese emerging demands.


MORE CONVENIENT REMOTE MANAGEMENT


New fields of application such as interference sy stems for artificial stem consolidation


intelligence (AI) and sy


through virt ualisation with hypervisor t echnologies, demands strong computing performance, a performance class at the embedded server level which classic embedded computer technology was unable to deliver.


T he number of cores as well as the bandwidth and number of high- performance interfaces was simply


8 APRIL 2019 | ELECTRONICS


too small, with c management fea However, proce


comprehensive remote atures missing.


such as AMD have made t technologies increasingly


affords all the funct server processors in t


FLEXIBLE DESIG COMPREHENSIV FEATURES


Thanks to compr and compatibility


essor manufacturers ve made their server reasingly efficient in


recent years and now offer mult systems in TDP c


now offer multiprocessor classes, which already nctions provided by s in the 30-100W class.


GN OPTIONS AND VE SECURITY


rehensive configuration y wit h competing


solutions, the AM flexible and attra for next-gen em Features for HP also include supp Radeon GPUs and point performanc die versions, esse Also beneficial integrated virtua EPYC embedded operation of RTO system, as well a security package System (SBS), Se


MD EPYC processors are a act ive migration platform mbedded server designs. PC and AI applications port of high-end AMD d improved floating- ce in both single and dual ential for AI applications. is the hardware-


alisat ion of the AMD processors for parallel OS and GPOS on one as the comprehensive e: from Secure Boot


(SME) and Secure Virtualisat (SVE), to the sec between two SEV


ecure Memory Encry ption ion Execution


cure migration channel V-capable platforms.


The AMD


Embedded 3000 processor


EPYC d 3000


r


socket solutions, Congatec also offers full-custom designs based on t processors. These ca


mplement dual- ngatec also offers based on these


efficiently with an application ready module and carrier board layout.


PROMISING ROADM EMBEDDED SERVER


MAP FOR


As a result, the server-on-module sector will strengthen, wit


R TECHNOLOGIES er-on-module


such as Congatec driving this trend forward by supportin


en, with companies iving this trend


under the PICMG specifications and offering comprehensive services for OEM customers. The new AMD EP


ng st andardisation ecifications and sive services for


Embedded 3000-based conga-B7 server-on-modules are just t beginning and the roadmap is very promising at both processor and server- on-module level.


Interested OEM cust


further information from Congatec, but an NDA agreement i


the current COM Express Ty


e new AMD EPYC sed conga-B7E3 are just the oadmap is very rocessor and server-


is designed to address the needs beyond the embedded high-end that, up until now, were served by integrated graphics.


Congatec


www.congatec.com T: +44 (0)7535 164837


837 / ELECTRONICS


stomers can request from Congatec, but is required. However, press Type 7 variant ess the needs beyond -end that, up until y modules with


an be realised more pplication-ready board layout.


warded with an d application-ready that includes all signs and guidelines mplementation of esigns in a small


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