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ADVERTORIAL TECHNOLOGY IN ACTION


Smiths Interconnect launches the next generation of its power connectors


Heavy Power Series, for on-board power applications within the rail market.


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The key innovation of the next generation of the Transformer Heavy Power Series is Smiths Interconnect’s innovative Tortac® technology, which draws on the exceptional characteristics of the Hypertac hyperboloid contact on equal pin diameter to feature smaller pitches, higher contact density and higher current ratings.


“Smiths Interconnect has designed a rugged, reliable and high-performance modular solution for railway applications, but also for hybrid and electric vehicles and various other industries.” said Paul Harris, VP Sales and Marketing. “The use of our distinctive Tortac® technology further enhances the connector’s performance and pushes the boundaries of innovation in design and manufacture of interconnect solutions to deliver a competitive edge to our customers.”


Smiths Interconnect  +39 010 60361  www.smithsinterconnect.com


ROLEC Enclosures


congatec boosts performance for rugged edge computing


EPYC Embedded 3000 processor is currently the cutting edge of embedded server technologies, offering up to 52% more instructions per clock compared to legacy architectures. Also attractive for edge server deployments is the support of the extended temperature range (-40 to 85 °C) for selected versions and the comprehensive RAS (reliability, availability and serviceability) features common to all


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versions. Developers can use the new conga-B7E3 modules as a drop-in replacement to boost performance within their closed loop engineering design cycles in manifold rugged edge applications. Use cases include Industry 4.0, smart robot cells with collaborative robotics, autonomous robotic and logistics vehicles, as well as virtualized on- premise equipment in harsh environments to perform functions such as industrial routing, firewall security, and VPN technologies.


congatec  +49-991-2700-0  www.congatec.com


SMTconnect trade fair: Precise, repeatable temperature profiling


processes. Launched at last year’s show, the profilers are now in serial production. They are showcased along with a comprehensive array of system components building on the established Datapaq Reflow Tracker program, which also comprises a dedicated software suite. These components include compact stainless-steel thermal barriers, thermocouples, and two sensor holding frames. These frames with fixed thermocouples save setup time and ensure high repeatability in monitoring process stability. The Datapaq Surveyor frame is designed to measure process performance at the critical board level. Together with the Insight Professional software, this tool detects trends in oven performance, allowing operators to take corrective action early on. The second sensor frame is a 12-thermocouple pallet for monitoring wave soldering process stability. Fluke Process Instruments at SMTconnect Nuremberg, Germany, 7 – 9 May 2019 Hall 4, Stand 118


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Fluke Process Instruments  marcom1.emea@flukeprocessinstruments.dewww.flukeprocessinstruments.com


36 APRIL 2019 | ELECTRONICS


t the 2019 SMTconnect, Fluke Process Instruments will present its new Datapaq DP5 data loggers for inline temperature profiling in reflow soldering


ongatec introduces its first Server-on-Module with AMD embedded processors. The new conga-B7E3 Server-on-Module with the AMD


Temperature monitoring for metals and steel


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luke Process Instruments presents its range of thermal profilers and infrared temperature measurement


solutions at the THERMPROCESS trade fair. The latest addition to the IR pyrometer portfolio, Thermalert 4.0, enables automatic noncontact temperature monitoring in a -40…2250 °C range. Due to the outstanding ambient temperature range of -20…85 °C, more measuring points can be set up without cooling. Another IR innovation, the industrial-grade thermal imager ThermoView TV40 with an integrated visible-light camera, is also on show. The fixed- installation thermal camera enables 24/7 temperature monitoring in a -10…1200 °C range. Developed to meet today’s demanding industrial automation requirements, it supports GigE streaming of images and automatic alarms. The manufacturer’s thermal profiling systems are represented by Datapaq TP3 data loggers, featuring up to 20 thermocouple channels and outstanding 3.6 million data points memory capacity. The loggers enable temperature uniformity surveys (TUS) and in-process product temperature monitoring.


Fluke Process Instruments at THERMPROCESS Düsseldorf, Germany, 25 – 29 June 2019 Hall 9, Stand C73


Fluke Process Instruments  marcom2.emea@flukeprocessinstruments.dewww.flukeprocessinstruments.com


CONNECTINGINDUSTRY.COM/ELECTRONICS


miths Interconnect announced the release of the next generation modular Transformer Connector Range –


holders. The wire holders can be clipped into the cabling ducts without tools. They make it easier to neatly arrange conductors and keep signal and power lines clearly apart. They also simplify adding new wiring, since existing cables stay put and do not come lose and entangled when the cover is removed. Last but not least, users will find it easier to clean their well-organized cabling duct of dust. The wire holders are available in two versions. The DHG type holder has closed spring brackets – cables can be pushed in from above. It comes in three sizes: 34 x 35 mm, 34 x 53 mm and 53 x 75 mm. The DHGB holder, on the other hand, is a small clip that securely holds cable ties of any size.


CONTA-CLIP


The organizer in the cabling duct C


ONTA-CLIP further enhances its range of usability aids for VK cabling ducts, adding fast-mount wire


christian.quade@conta-clip.de


www.conta-clip.com


New Round Plastic Enclosures For IoT and Industry 4.0 Electronics R


OLEC has launched technoDISC – unique round plastic enclosures for industrial electronics. The housings are sealed to IP 66 (IP 67 optional),


making them ideal for Industry 4.0 and IoT applications both indoors and outside. These ‘go anywhere’ enclosures can be fitted to walls, bulkheads, machines –


even when closed (protecting the seal and electronics during installation). Clip- on POM (polyoxymethylene) trims cover all the fixing and mounting screws. The enclosures are available in four sizes from 110 x 97 x 55 mm to 190 x 179


x 90 mm. The lid is recessed to accommodate a round membrane keypad or product label. Internal fastening pillars are provided for fitting PCBs and mounting plates. The cases are moulded in UV-stable and flame-retardant Luran ASA (UL 94 V-


0). The standard colour is light grey, similar to RAL 7035. The POM clip-on covers are anthracite grey. ROLEC can supply the enclosures fully customised.


 01489 583858  www.rolec-enclosures.co.uk


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