NEW WIRELESS PLATFORM ENABLES NEXT-
IRELESS PLATFO ES NEXT-
I
PRODUC oT developers routin
wireless range, power consumption ower consumption, size, security an, size, security and cost. Withd cost. With Series 2 of its Wire
oT developers rou ge, po
nd reusable software, optimised for smart home, commercial an industrial IoT appl ications such as gateways, voice assis
smart electric meters. Initial products include small-form-factor SoC devices with a ded
dustrial IoT applications such as gateways, voice assistants an stants and smart electric met
devices with a dedicated security core an wide wireless range.
developers seek flexible con bring differentiate market, while redu
tiated products to
arket, while reducing cost and design complexity Johnson, senior vic
complexity,” says Matt ior vice presiden
eries 2 aims
ucing cost an ,” says Matt
ce president and
general manager oeneral manager of IoT products of IoT products at Silicon Labs, “Series 2 aims to improve design elements, including wireless performance, software reuse, RF communication reliability and enhanced security to speed development, deploymen nt, deployment and adoption of Io
www.silabs.com
cluding wireless performance, software reuse, RF an
and adoption oT.” RFI/EMI
shielding gaskets & components
F communication enhanced security to -chip radio with a chip r radio with a
“As the adoption and diversity of IoT devices continues to grow, developers seek fle
GENERATION CONNECTEDATION CONNECT PRODUCTS TO SCALE IOTCTS TO SCALE IO
utinely face product design tradeoffs aroun tradeoffs around
eries 2 of its Wireless Gecko platform, Silicon Labs aims to simplify eless Gecko platform, Silicon Labs aim IoT product design and reusable softw
-a-chip (SoC) option mmercial and
ms to simplify
n with integrated system-on-a-chip (SoC) options ware, optimised for smart home, commercial an
ters. Initial products include small-fo rm-factor SoC dicated security core and an on-chip r ge.
n and diversity of IoT devices continues to grow, exible connectivity solutions that hel p them quickly ed products to
s that help them quickly
ORM TED
KYOCERA AND VICOR CORPORATION TO
KYOC CORP
COLL POW SOLU
K
CERA AND VICOR PORATION TO
COLLABORATE ON ADVANCED POWER-ON-PACKAGE SOLUTIONS
LABORATE ON AD ER-ON-PACKAGE UTIONS
DVANCED E
-generation power-on-package (PoP) solutions for emerging processor technologies, the companies have announced, hoping t technologies, the companies have an nounced, hoping to address the rapid growth of higher performing processors, which itself has created proportionate growt current con
yocera Corporat on and Vicor Corporation will collaborate onocera Corporatiion and Vicor Corporation will collaborate on next-generation power-on-package (PoP) solutions for emerging
will collaborate on current consumption demands.
he rapid growth of higher performing processors, which created proportionate growth in high-speed I/O nsumption demands.
processors, which -speed I/Os and high
yocera’s proprietary solutions to optimise processor performance and reliabi lity are based on its packaging, modular and motherboard designs, assisted through the application of Vicor’s PoP devices. ssisted through the application of Vicor’s P By utilising this combined design technology nd manufacturing facturing e, Kyocera
By utilising this combined design technology, simulation tools and manuf experience
g this combined design technology, s
experience, Ky and Vicor a
and Vicor aim to mat the expanded I/O functionali
through its solutions to artificial int
aim to match ded I/O
functionality and high current pow
current power delivery expected in
ty and high wer delivery
xpected in the industry through its
o artificial intelligence (AI) and performance processor a
processor applications.
www.vicor
icorpower.com
l intelligence erformance applications.
rpower.com
n the industry, s solutions
Kyocera’s proprietary solutions to optimise processor performance nd reliability are based on its packaging, modular and motherboard
processor performance ular and motherboard cor’s PoP devices. imulation tools
Flock & Siemens
www.kemtron.co.uk +44 (0) 1376 348115
info@kemtron.co.uk / ELECTR ELECTRONICS RONICS
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ELECTRONICS | APRIL 2019 7
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