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NEW WIRELESS PLATFORM ENABLES NEXT-


IRELESS PLATFO ES NEXT-


I


PRODUC oT developers routin


wireless range, power consumption ower consumption, size, security an, size, security and cost. Withd cost. With Series 2 of its Wire


oT developers rou ge, po


nd reusable software, optimised for smart home, commercial an industrial IoT appl ications such as gateways, voice assis


smart electric meters. Initial products include small-form-factor SoC devices with a ded


dustrial IoT applications such as gateways, voice assistants an stants and smart electric met


devices with a dedicated security core an wide wireless range.


developers seek flexible con bring differentiate market, while redu


tiated products to


arket, while reducing cost and design complexity Johnson, senior vic


complexity,” says Matt ior vice presiden


eries 2 aims


ucing cost an ,” says Matt


ce president and


general manager oeneral manager of IoT products of IoT products at Silicon Labs, “Series 2 aims to improve design elements, including wireless performance, software reuse, RF communication reliability and enhanced security to speed development, deploymen nt, deployment and adoption of Io www.silabs.com


cluding wireless performance, software reuse, RF an


and adoption oT.”     RFI/EMI


shielding gaskets & components


      F communication enhanced security to -chip radio with a chip r radio with a


“As the adoption and diversity of IoT devices continues to grow, developers seek fle


GENERATION CONNECTEDATION CONNECT PRODUCTS TO SCALE IOTCTS TO SCALE IO


utinely face product design tradeoffs aroun tradeoffs around


eries 2 of its Wireless Gecko platform, Silicon Labs aims to simplify eless Gecko platform, Silicon Labs aim IoT product design and reusable softw


-a-chip (SoC) option mmercial and


ms to simplify


n with integrated system-on-a-chip (SoC) options ware, optimised for smart home, commercial an


ters. Initial products include small-fo rm-factor SoC dicated security core and an on-chip r ge.


n and diversity of IoT devices continues to grow, exible connectivity solutions that hel p them quickly ed products to


s that help them quickly


ORM TED


KYOCERA AND VICOR CORPORATION TO


KYOC CORP


COLL POW SOLU


K


CERA AND VICOR PORATION TO


COLLABORATE ON ADVANCED POWER-ON-PACKAGE SOLUTIONS


LABORATE ON AD ER-ON-PACKAGE UTIONS


DVANCED E


-generation power-on-package (PoP) solutions for emerging processor technologies, the companies have announced, hoping t technologies, the companies have an nounced, hoping to address the rapid growth of higher performing processors, which itself has created proportionate growt current con


yocera Corporat on and Vicor Corporation will collaborate onocera Corporatiion and Vicor Corporation will collaborate on next-generation power-on-package (PoP) solutions for emerging


will collaborate on current consumption demands.


he rapid growth of higher performing processors, which created proportionate growth in high-speed I/O nsumption demands.


processors, which -speed I/Os and high


yocera’s proprietary solutions to optimise processor performance and reliabi lity are based on its packaging, modular and motherboard designs, assisted through the application of Vicor’s PoP devices. ssisted through the application of Vicor’s P By utilising this combined design technology nd manufacturing facturing e, Kyocera


By utilising this combined design technology, simulation tools and manuf experience


g this combined design technology, s


experience, Ky and Vicor a


and Vicor aim to mat the expanded I/O functionali


through its solutions to artificial int


aim to match ded I/O


functionality and high current pow


current power delivery expected in


ty and high wer delivery


xpected in the industry through its


o artificial intelligence (AI) and performance processor a


processor applications. www.vicor


icorpower.com


l intelligence erformance applications. rpower.com


    


n the industry, s solutions


Kyocera’s proprietary solutions to optimise processor performance nd reliability are based on its packaging, modular and motherboard


processor performance ular and motherboard cor’s PoP devices. imulation tools


Flock & Siemens


www.kemtron.co.uk +44 (0) 1376 348115 info@kemtron.co.uk / ELECTR ELECTRONICS RONICS


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ELECTRONICS | APRIL 2019 7


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