SUPPLEMENT ENCLOSURES & ENCLOSURE FURNITURE


SOLUTIONS FOR CENTRALISED OR DECENTRALISED AUTOMATION


P


acking components into an enclosure is a science and an art. The engineer


must plan the interior configuration to reduce wasted space and optimise the size of the enclosure, yet avoid issues such as over-heating or problems of future access to any of the components. Rittal offers its customers a range of solutions for the safe packing of sophisticated electronics systems, both centralised and decentralised, as well as a huge range of enclosures in different sizes, materials and paint specs. Employing the company’s sophisticated Eplan software allows engineers to populate the panel in a CAD format, optimising the use of space while enabling changes to be made quickly and easily before applying them.


We live in a world of rapid change, driven by the growth of ‘smart technology’. Automation components are becoming more compact, both for centralised and decentralised applications, while still delivering considerable computing power. Sensors and actuators are also getting more ‘intelligent’. With this in mind, Rittal offers customers a range of solutions for the safe packing of sophisticated systems within this changing marketplace


RITTAL ‘THERM’ SPEEDS-UP CLIMATE CALCULATIONS Component size is typically determined by the space needed for terminals, connectors and clamps, as well as their accessibility for commissioning, servicing and maintenance. As components get smaller, enclosure packing density is increasing. Furthermore, new functionality such as power management and networking, means that additional components are being put in all the time. Paul Metcalfe, Rittal’s industrial and outdoor enclosures product manager, comments: “Reducing the size of


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