SEM ACCESSORIES


n EPO-TEK – Epoxy Conductive Adhesive n EPO-TEK®


EE129-4 Epo-Tek® EE129-4 is a room temperature cure, silver-filled epoxy,


designed for making electrical connection in SEM mounting sample, circuit assembly, semiconductor, LCD applications.


Epo-Tek® EE129-4 comes with two parts: A & B and mixing ratio is 1:1. Shelf life is one year at room temperature


Works well with surface like Au, Ag-Pd, Cu, brass, Kovar, stainless steel, as well as ceramic, PCB, solder masks, most plastic and glasses


z Low temperature cures capable from 23°C to 80°C. z Suggested for cryogenic cooling applications z Works well in SEM, microscopy applications


z Works well in aerospace hybrid circuits and ITO electrodes in LCD packaging and assembly


z Reasonable pot life of 3 hours, allows for preparation. z Smooth thixotropic paste allows for many way of application


Maximum Bond Line Cure Schedules:


100°C......................15 minutes 80°C ...............................1 hour 70°C..............................2 hours


Typical Properties


Physical Properties: Color:


Consistency:


Viscosity (@ 100 RPM / 23˚C): Thixotropic Index:


Glass Transition Temp (Tg):


Coefficient of Thermal Expansion (CTE):


Shore D Hardness:


Lap Shear Strength @ 23˚C: Die Shear Strength @ 23˚C: Weight Loss:


Degradation Temp (TGA): Operating Temp:


Storage Modulus @ 23˚C: Ion:


Particle Size:


Electrical Properties: Volume Resistivity @ 23˚C:


Volume Resistivity @ 23˚C (23˚C/24 hour cure):


Thermal Properties Thermal Conductivity:


23°C............................24 hours Pot Life .........................3 hours


(to be used as a guide only, not a specification)


Part A – silver; Part B – silver Smooth, thixotropic – 4000 cPs 2,000 – 4000 cPs 4.6


≥ 45˚C (Dynamic cure 20 – 200˚C / ISO 25 Min; Ramp -10 – 200˚C @20˚C/Min)


Below Tg: 30 x 10-6 Above Tg: 227 x 10-6


63 1,110 psi ≥ 5 kg / 1,700 psi


@200˚C: 0.18%; @250˚C: 0.54%; @300˚C: 2.06%


303˚C


Continuous: -55˚C to 150˚C Intermittent: -55˚C to 250˚C


156, 318 psi Cl-


NH4+


223 ppm; Na+ 22 ppm; K+


≤ 45 microns


≤ 0.0003 Ohm-cm 0.01 Ohm-cm


1.60 W/mK


Epo-Tek® Solder:


RT 12670-EE Epo-Tek® EE129-4 Adhesive 1 oz RT H20E: 12671-20E Epo-Tek®


26 ppm 12 ppm


in/in/˚C in/in/˚C Maximum Bond Line Cure Schedules:


175°C......................15 minutes 150°C .............................1 hour


Physical Properties: Color:


Consistency:


120°C............................2 hours 80°C............................24 hours


Typical Properties (to be used as a guide only, not a specification)


Part A – silver; Part B – silver Smooth, thixotropic


Viscosity (@ 100 RPM / 23˚C): 2,200 – 3,200 cPs Thixotropic Index:


3.69


Glass Transition Temp (Tg): ≥ 80˚C (Dynamic cure 20 – 200˚C / ISO 25 Min; Ramp -10 – 200˚C @20˚C/Min)


Coefficient of Thermal Expansion (CTE):


Shore D Hardness:


Below Tg: 31 x 10-6 Above Tg: 158 x 10-6


75


Lap Shear Strength @ 23˚C: 1,475 psi Die Shear Strength @ 23˚C: ≥ 5 kg / 1,700 psi Weight Loss:


Degradation Temp (TGA): Operating Temp:


Storage Modulus @ 23˚C: Ion:


Particle Size:


Thermal Properties Thermal Conductivity: Thermal Conductivity:


Thermal Resistance:


808, 700 psi Cl-


@200˚C: 0.59%; @250˚C: 1.09%; @300˚C: 1.67% 425˚C


Continuous: -55˚C to 200˚C Intermittent: -55˚C to 300˚C


73 ppm; Na+ ≤ 45 microns


Electrical Properties: Volume Resistivity @ 23˚C: ≤ 0.0004 Ohm-cm


2.50 W/mK


29 W/mK Based on Thermal Resistance Data: R=L x K-1 x A-1


(Junction to Case): TO-18 package with nickel-gold metalized 20 x 20 mil chips and bonded with Epo-Tek H20E (2 mil thick)


6.7 to 7.0˚C/W 4.0 to 5.0˚C/W


H20E Adhesive 1 oz continued ››››› 34


Electron Microscopy Sciences In PA: (215) 412-8400 • Toll-Free (800) 523-5874 Fax (215) 412-8450 or 8452 • email: sgkcck@aol.com or stacie@ems-secure.com • www.emsdiasum.com


2 ppm; NH4+ 98 ppm; K+ 3 ppm in/in/˚C in/in/˚C


n EPO-TEK® Epo-Tek®


H20E H20E is a two component, 100% solid


silver-filled epoxy system, silver-resin paste and liquid hardener, mixing ration is 1:1.


z Epo-Tek H22E features high thermal conductivity, and is very well suited for extensive high temperature applications (300 – 400°C)


z Epo-Tek H20E is also a conductive adhesive of choice for old or new applications.


z Its applications include: chip bonding and electronic bonding as well as SEM mounting.


z H20E contains no solvents and will not outgas.


z When cured, H20E is resistant to solvents, resin and moisture


z Long Pot life (2½ days) z Shelf life is one year when store at 23°C


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