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Page 26


www.us- tech.com


June, 2019


Indium Launches High-Purity Trichloride Compound


Clinton, NY — IndiTri™ is Indium Corporation’s proven high-purity in-


dium trichloride (InCl3) that delivers a consistent percentage of indium with a wide range of applications. IndiTri is used as a starting com-


pound for the synthesis of other inor- ganic and organic indium com- pounds, making it excellent for re- search and development projects. It is also commonly used in the produc- tion of alkaline batteries and in com- pound semiconductors, such as LEDs and lasers. IndiTri has been developed to deliver controlled, low moisture con-


tent with low- and high-density op- tions to suit application needs. Indi- um Corporation is a premier materi- als manufacturer and supplier to the global semiconductor, thin-film and thermal management markets. Prod- ucts include solders and fluxes, brazes, thermal interface materials (TIMs), sputtering targets, indium, gallium, germanium, tin metals and


inorganic compounds, and NanoFoil®. Contact: Indium Corp., 34


Robinson Road, Clinton, NY 13323 % 315-381-7524


E-mail: abrown@indium.com Web: www.indium.com


Heraeus: Solder Paste for Auto Electronics


West Conshohocken, PA — For the production of miniaturized electrical systems, such as those used in the automotive industry, solder material must meet extremely high require- ments. Heraeus Electronics has devel-


oped a new solder paste, Microbond SMT650, designed to guarantee con- sistently high surface resistance. The combination of the new F650 flux system with Innolot metal alloy in- creases reliability and prevents elec- trochemical migration even under the most extreme environmental con- ditions. To accommodate all the elec-


 


tronics necessary in automobiles means that individual components must be smaller than ever. Miniatur- ization and the corresponding ever- shrinking distances between conduc- tor paths lead to higher electrical field strengths. This increases the risk of electrochemical migration. With its special material compo-


sition, Microbond SMT650 offers a consistently high surface resistance to prevent the risk of electrochemical migration. The chemical composition of the new flux is decisive here. Microbond SMT650 is compati-


ble with many protective lacquers for electronics and printed circuit boards. The specially developed F650 flux system can be combined with a


Microbond SMT650 solder paste demonstrating no dendrite formation.


variety of alloys. The patented In- nolot alloy is intended for applica- tions with high requirements, such as in the automotive sector. Innolot contains various metals


that increase the service life of the entire electronic assembly through their high thermomechanical stabili- ty, which allows longer use at higher


temperatures. Contact: Heraeus, Inc., 24


Union Hill Road, West Conshohock- en, PA 19428 % 215-944-9981 E-mail: jeffery.oddo@heraeus.com Web: www.heraeus-electronics.com


               


Manufactured in the U.S.A. since 1966 www.westbond.com


1551 S. Harris Court Anaheim, CA 92806 Tel 714·978·1551


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