Jan/Feb, 2024
www.us -
tech.com
PLYMOUTH, WI — Rework and repair have been established production processes, but many electronics manufacturers need more automation. Communication electronics
and IT infrastructure rely on in- creasingly powerful circuit boards with high-quality compo- nents — this is where a repair quickly pays for itself. The HR 600 XL modular rework platform is designed for this. The process- ing of large assemblies is de- signed for board sizes up to 25.6 x 49.2 in. (650 x 1,250 mm) with an expandable bottom heater and suitable PCB holder. Matrix heating is used to adapt the
TRI Intros Large Board AXI Platform
SAN JOSE, CA — Test Research has unveiled its latest innova- tion, the large board X-ray in- spection platform — TR7600F2D QL. This cutting-edge system sets a new benchmark in X-ray inspection technology, catering to the evolving needs of large board applications, especially in automotive and telecommunica- tions electronics manufacturing. The AXI TR7600F2D QL in-
spects large boards measuring up to 2,100 x 510 mm. The high-reso- lution platform is capable of in- spection with resolution ranges from 5 to 25 µm, ensuring preci- sion and accuracy in defect detec- tion for multiple applications. Equipped with AI algorithms
surpassing conventional gray- level-based methods, the AXI TR7600F2D QL excels in detect- ing void and open defects with re- markable accuracy. This ensures robust coverage and reliability in
heating surface to the dimen- sions of the assembly and the power distribution of the pre- heater is dimensioned to the ap- plication. The system can be adapted
using interchangeable heating heads, depending on component size and energy requirements. With a large heating head with 5.9 x 4.7 in. (150 x 120 mm) ef- fective area and 2,800W total power, very large components can be desoldered and soldered and upgrading can be carried out gently. Additional functions for
automated processes are avail- able for the HR 600 XL platform, which can also be retrofitted to existing systems. After desoldering a compo-
Page 29 Highly Automated Component Repair from Kurtz Ersa
nent, any remaining solder usu- ally has to be removed. With the Auto Scavenger module, there is now a fully integrated functional unit for this — immediately after removing the component, the suction nozzle of the Auto Scav- enger is lowered over the circuit board and the residual solder is automatically removed without
any contact. Contact: Kurtz Ersa, Inc.,
HR 600 XL rework platform.
1779 Pilgrim Road, Plymouth, WI 53073 % 920-893-1779 E-mail:
ernie.grice@
kurtzersa.com Web:
www.ersa.com
TR7600F2D QL X-ray system.
identifying defects across various components such as BGAs, capac- itors, chips, WLCSP, DIMM con- nectors, and more. One of the standout features
of the AXI TR7600F2D QL is its specialized 2D camera, specifi- cally designed for automotive ap- plications,
reading and fiducial detection. Contact: Test Research
USA, Inc., 832 Jury Court,
Suite 4, San Jose, CA 95112 % 408-567- 9898 fax: 408-567-9288 E-mail:
triusa@tri.com.tw Web:
www.tri.com.tw
including barcode
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