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August 2025


www.us-tech.com 50 Years of productronica


MUNICH, GERMANY — When productronica takes place in Munich from November 18 to 21, 2025, a milestone birthday will be on the agenda. The world’s leading trade fair for the devel- opment and production of elec- tronics is celebrating its 50th anniversary. Originally launched as an


exhibition area of electronica, over the course of half a century pro- ductronica has developed into the leading international meeting place for electronics manufactur- ing. The conceptual sponsor of productronica is the industry association VDMA Productronic. Messe München CEO Dr.


Reinhard Pfeiffer offers his con- gratulations on the event’s anniversary: “For 50 years now, productronica has been showcas- ing innovations along the entire value chain of electronics manu- facturing. It therefore plays an indispensable role by setting the pace for the entire industry. Together with electronica, it also strengthens Munich’s position as a leading international electron- ics location.” This fall, more than 1,400


companies from the fields of PCB and EMS, SMT, semiconductors, inspection and quality, future production and smart factory, and cables, coils and hybrids will present their solutions and prod- ucts at productronica. Among others, key players such as ASMPT, Ersa, Fuji, Komax, Rohde & Schwarz and Viscom have already confirmed their participation in the event. This year’s productronica


will focus on three key topics. Advanced packaging, power elec- tronics and securing the value chain through reliable microelec- tronics. Compared to traditional


chip encapsulation, Advanced Packaging uses innovative approaches such as 2.5D and 3D integration, chiplet technologies and wafer-level packaging to maximize the performance of modern electronic systems. These technologies are cru-


cial for applications in high-per- formance computers, AI acceler- ators, 5G and IoT devices as well as in automotive and medical technology. Thanks to shorter signal paths, improved heat dis- sipation and higher bandwidths, advanced packaging not only increases the efficiency of semi- conductor systems, but also helps to reduce production costs and material consumption. It therefore plays a key role in the further development of micro- electronics and enables innova- tions in an increasingly net- worked world. Power electronics are essen- tial for applications in e-mobili-


ty, renewable energies, industri- al automation and power semi- conductors for high-frequency and high-voltage applications. By using modern semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN), it is possible to reduce power losses and component sizes while improving operational reliabili- ty. Power electronics therefore makes a significant contribution to a sustainable and resource- saving energy supply and to the further development of innova- tive technologies in various


industries. Secure microelectronics


refers to the development and production of safe, dependable and tamper-proof semiconductor technologies along a transparent and controlled value chain. The aim is to ensure the integrity, authenticity and cybersecurity of microelectronic components- especially in safety-critical appli- cations. This technology is of central


importance for the likes of the automotive, industrial automa- tion, medical technology and


defense sectors, where the avail- ability and protection of sensi- tive data and resistance to attacks are essential. By using security-certified manufacturing processes,


traceable supply


chains and hardware-based security mechanisms, secure microelectronics make a signifi- cant contribution to protecting digital infrastructures and tech-


nological sovereignty. Contact: Messe München,


AM Messesee 2, 81829 Munich, Germany % +49-89-94-920-720 Web: www.messe-muenchen.de


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