August 2025
www.us -
tech.com TRI Unveils New Multi-Camera AOI
SAN JOSE, CA — Test Research, Inc. (TRI) has introduced its new TR7500 SIII Ultra. The new multi camera AOI solution features ad- vanced inspection technology, de- livering speed and precision for electronics manufacturing. The new AOI TR7500 SIII
Ultra features multi-angle side- view inspection with four side- angled cameras and one top cam- era for full coverage defect detec- tion. The sideview cameras allow the platform to inspect inner layer bridges, hidden lifted leads, and other out-of-sight de- fects. The TR7500 SIII Ultra also
A.P.E. Offers Classic Desoldering Hand Tool
KEY LARGO, FL — A.P.E. is now offering its classic “solder sucker” desoldering hand tool, which is enjoying a resurgence in popularity thanks in part to larg- er, heavier volume soldering tasks. It is one of the company’s original products and is simple and reliable. It was originally used for through-hole PWBs, but is now
supports optional capabilities such as AI-powered inspection, metrology-grade measurements, and 3D laser imaging to enhance accuracy and coverage. Built on the same high-pre-
cision platform as TRI’s flagship TR7700Q SII, the TR7500 SIII Ultra enhances mechanical per- formance with ballscrew Z-axis control and an AC servo motion controller. The structural design has also been significantly up- graded. Compared to its prede- cessor’s welded steel frame, the TR7500 SIII Ultra is built on a
vibration-resistant cast iron base that provides superior rigidity
and inspection stability. The TR7500 SIII Ultra sup-
ports current smart factory and communication standards, in- cluding SMEMA, SECS/GEM, IPC-CFX-2591, and IPC-HER- MES-9852, ensuring a cost-effec- tive, Industry 4.0-compliant solu- tion for comprehensive defect de-
tection and data exchange. Contact: Test Research
USA, Inc., 832 Jury Court, TR7500 SIII Ultra AOI system.
Suite 4, San Jose, CA 95112 % 408-567- 9898 E-mail:
triusa@tri.com.tw Web:
www.tri.com.tw
Page 27
Desoldering tool.
applied to more advanced SMT applications where rework of large packages and EV applica- tions require rapid removal of larger volumes of solder. This is especially true for re-
work involving power supplies, large BGA components and simi- lar challenging rework tasks, such as large-size chip packages, where larger amounts of solder must be removed during the re- work process. The revival of the “solder
sucker” goes hand in hand with APE’s expansion into the world of contract rework and repair services for commercial, mili- tary, aviation and aerospace ap- plications. The company has been a long-time defense con- tractor, providing rework servic- es and equipment to the U.S. government for more than 50 years. The APE-5000 joins more than 30 other APE rework and repair products for the electron-
ics manufacturing industry. Contact: A.P.E., 2 N Black-
water Lane, Key Largo, FL 33037 % 305-451-4722 E-mail:
sales@ape.com Web:
www.ape.com
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