TESCAN S9000X


Ultimate resolution and maximum throughput in physical failure analysis of semiconductor devices and material microanalysis


� Extremely large cross-section: New iFIB+™ Xe plasma FIB with high currents up to 2 μA and unmatched FoV of 1 mm redefines conventional large-area cross-sectioning and dramatically decreases sample preparation time.


� Extended imaging capabilities: Next generation Triglav SEM column with improved and optimized in-beam detection system, and extending imaging capabilities, that now include energy-filtering BSE signal collection for ultimate surface sensitivity in sample characterization.


� Applications easier than ever: New TESCAN Essence™ software platform offers a simplified, user-friendly and customizable interface for effortless and maximum control in all applications, regardless the user skill level.


UHR SEM


1.0 nm 0.7 nm at 15 keV


For more information visit www.tescan.com


TESCAN USA


TESCAN DO BRASIL


TESCAN UK


TESCAN FRANCE


TESCAN ANALYTICS


ORSAY PHYSICS


TESCAN XRE


TESCAN BENELUX


TESCAN GmbH


TESCAN Brno


TESCAN CHINA


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