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MICRO FLUIDICS | ARTICLE


Breaking and Dicing After processing of the glass substrates, they are divided into chips. For dividing the bonded substrates into individual micro fluidic chips two techniques are used. With the standard process flows additional steps are taken to break out glass devices out of the processed substrates. This is a patented, proven high quality, fast and very cheap process step. Breaking out the chips is possible from a minimum device size of 10 x 10 mm and is done in a cleanroom environment. A major advantage over dicing is that no cooling fluids are needed. This reduces the risk of polluting the channels.


<< Figure 6: SideConnect technology. >>


For the fabrication of smaller chips and chips with tight tolerances on outer dimensions, Micronit dices the chips with a conventional CNC controlled, programmable dicing machine.


www.micronit.com


34 | commercial micro manufacturing international Vol 7 No.3


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