NEWS // FEATURES // NEW PRODUCTS
BPM Microsystems Passes on Cost Savings to Customers
BPM Microsystems announces that it has reduced pricing for its manual programmer product line by as much as 54%. By reinvesting in manufacturing equipment that has brought the production of motherboards, analog boards, power boards and all site technology back in-house, the company was able to improve its manufacturing process, which lead to reduced cost structures. “With the acquisition of a new SMT line last year, we were able to streamline our manufacturing process and improve quality control considerably,” said Vice President of Operations Jon Bondurant. “By implementing these improvements in manufacturing organization, we have increased efficiency, which has enabled us to pass cost savings on to our customers.” In addition to lower pricing, BPM
Microsystems was able to reduce lead times by improving its just-in-time manufacturing capabilities. “We wanted to be more flexible
and responsive to our customers’ demands,” said Bondurant. “Moving manufacturing back in-house enables greater agility. It allows us to improve upon order fulfillment, ramp production at a moment’s notice and control our own logistics and delivery schedules.” Products with reduced pricing include the company’s 6th and 7th Generation classic product lines – 1610, 1710, 2610 and 2710 – and the latest 8th Generation and Flashstream product lines – 2800 and 2800F-MK2. Pricing for the manual
programmers can be viewed on the company’s Web site at
www.bpmmicro.com.
Conductive form-in-place gasket selector guide helps design engineers solve housing EMI shielding challenges
Chomerics Europe, a division of Parker Hannifin,has introduced a comprehensive new selector guide for its range of CHOFORM form-in- place (FIP) conductive gaskets. The range of materials provide lowest total cost of ownership solutions for the EMI shielding of enclosures with small section and complex patterns in applications such as medical electronics, automotive, telecoms, consumer, plus marine and aerospace. The materials included in the
selector guide use either thermoset or RTV curing systems in combination with a wide range of conductive particle technologies to offer designers a choice of cost versus shielding performance options to best match their application needs. Chomerics’ corrosion resistant FIP materials provide protection against galvanic activity and can eliminate the need for nickel or tin plating and secondary environmental gaskets. For outdoor, harsh environment
applications, CHOFORM 5572 and 5557 that use Silver/Aluminium (Ag/Al) and Silver/Nickel (Ag/Ni) fillers respectively, provide an ideal high temperature, high corrosion resistance solution.
CHOFORM 5506 and 5519 that utilise a Silver/Copper (Ag/Cu) filler are more suitable for less demanding indoor applications. CHOFORM 5519 has a very low Shore A hardness meaning it offers the most effective solution for equipment where low closure forces are needed. All Chomerics CHOFORM materials
offer shielding effectiveness in excess of 60 dB at frequencies ranging from 200 MHz to 12 GHz and electrical conductivity as low as 0.005 ohm-cm. Operating temperature ranges up to 150 ºC for some variants mean that materials are available to suit even the most demanding applications. The FIP selector guide lists all of
the specifications for each material to enable designers to make the optimum choice for their product design. Furthermore, Parker Chomerics engineers can provide additional customer support at all stages of the design process to help selection of the most appropriate material, optimise the design of the component housings, dispense technique and supply chain management. For details, visit
www.parker.com/
chomerics.
6 EIU
www.electronicscomponentsworld.com /
www.electronicsproductionworld.com
March 15th
2012
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