Thermal conductivity | materials feature
agglomerated powder grade (PCTH10MHF). “Boron Nitride, unlike other ceramics, is soft and
non-abrading, enabling longer life for injection-mould- ing and extruding equipment” says Neelam Kumar, product manager for CarboTherm. “Additionally, CarboTherm offers two distinct advantages over carbon-based fillers – it enhances plastic’s inherent electrical isolation properties instead of altering it, and its white colour makes it ideal where a combination of high thermal conductivity along with pleasant aesthet- ics or addition of colorants is required.” Momentive is another major BN supplier. Last year,
it introduced CoolFX hybrid fillers, which contain BN and other unspecified thermally conductive and electrically insulating fillers. The new fillers comple- ment the company’s existing PolarTherm platelet and agglomerate grades, and CoolFlow mixed grades. They are designed to provide “attractive improvements in physical properties while maintaining thermal conduc- tivity at a lower total cost”. The hybrid fillers have been developed to offer easier
processing and more consistent feeding compared to traditional boron nitride fillers. Allison Yeske, global
Comparing thermally conducting and electrically insulating additives BN
AlN Al2
Typical thermal properties Thermal Conductivity (W/m-K) Specific Heat (J/kg-K @ 25 ˚C) Theoretical Density (g/cc)
Typical electrical properties Dielectric Constant
Volume Resistivity (ohm-cm)
Typical mechanical properties Coefficient of Expansion (ppm/K) Young’s Modulus (GPa) Knoop Hardness (kg/mm2 Mohs Hardness
)
300+ 794 2.25
3.9 1015
260 734 3.26
8.8 1014 O3 30
798 3.98
9.7 1014 SiO2 1.4
689 2.20
3.8 1014
ZnO 54
523 5.64
9.9 107
<1 40 11 <2
4.4 400 6.7 340
1200 1500 ~7
>9
technical marketing manager, says that CoolFX grades “represent a new generation of fillers”. She adds that their higher bulk density may lead to easier handling and feeding, while powder flow properties can be improved, and the use of a coupling agent improves wetting.
0.5 72
500 ~6.5
0.7 12
387 4.5
Source: Momentive
Compounding Technology Inc. Licensing Cable Compound Technologies on a Turn Key Basis Globally
At the forefront of cable compounding technology, KDC Compounding Technology, Inc. licenses and manufactures our advanced cable compound technologies in the areas of wire and cable compounds for Low Voltage (silane moisture curable XLPE), Medium Voltage (peroxide XLPE compound, XL semiconductive compound), and Telecommunication and Flame Retardant Cables (halogen free flame retardant polyolefin compound, flame retardant silane crosslinkable polyolefin compound).
Our company licenses our technologies on a turn key basis to companies globally in addition to manufacturing Low Voltage XLPE compounds in a joint venture as Al Hodaifi Cable Compounding Company with Al Hodaifi Group in the State of Qatar.
www.kdctechnology.com
KDC Compounding Technology Inc. Copyright 2013. All rights reserved
KDC Compounding Technology Inc.
Suite B-3112 Intellige II, Jeongjadong 24 Bundanggu, Sungnam City, Gyeonggido, 463-010, Korea Phone: 82-(0)31-716-0492 Fax: 82-(0)31-716-0494 Email:
compounding@kdctechnology.com
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