Title
around
the world
COMPONEX NEPCON India SMT/HYBRID/PACKAGING
February 24-26, 2009 May 5-7, 2009
New Delhi, India Nuremberg, Germany
SMART SYSTEMS JPca 2009
INTEGRATION June 3-5, 2009
March 10-11, 2009 Tokyo Japan
Brussels, Belgium
national electronics Week
APEX June 16-18, 2009
March 31-April 02, 2009 Earls Court, London, UK
Las Vegas, NV, USA
semIcon West
NEPCON China 2009 June 14-16, 2009
April 21-24, 2009 San Francisco, CA, USA
Shanghai, People’s Republic
of China
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48 – Global SMT & Packaging – February 2009
www.globalsmt.net
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