Contents
Volume 9, No. 2
February 2009
American edition
Global SMT & Packaging
is distributed by controlled
circulation to qualified
Contents
personnel. For all others, sub-
scriptions are available at
2 Protectionism is not the answer
a cost of £165.00 for the
Trevor Galbraith
current volume (twelve issues).
10
TechNology Focus
No part of this publication may
be reproduced, stored in a
10 Strain gage testing: the delta effect of thermal cycle testing
retrieval system, transmitted
Mark T. McMeen, STI Electronics, Inc.
in any form or by any means
electronic, mechanical, 20 Resolution of solder voids in pin-in-hole product
photocopying, recording or Condia Yu, Eddie W. W. Tang, Jack To & Ka Wai Chan, Elec &
!
otherwise without prior writ- Eltek, and Brian Carlson, Rick Chen, PS Hou, Phil Isaacs, Eddie
ten consent of the publisher.
Kobeda, Sunil Nigam, Jeffrey Taylor & Kaspar Tsang, IBM and
No responsibility is accepted for
IBM China.
the accuracy of information
contained in the text,
36 A new angle on printing
illustrations or advertisements.
George Babka and Scott Zerkle, Assembléon Americas; Frank An-
20
The opinions expressed in the
dres, Rahul Raut and Westin Bent, Cookson Electronics Assembly
articles are not necessarily those
Materials; and Dave Connell, Research in Motion
of the editors or publisher.
special FeaTures
46
ISSN No. 1474-0893
46 NBS turns over a new leaf: Michael Maslana interview
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4 IC packaging technology retrospective—
part 1
other regular Features
Joe Fjelstad
6 Industry News
32 2009 & 2010: The coming global recovery 9 Global SMT & Packaging Online
Walt Custer and Jon Custer-Topai 40 New Products
48 Global SMT & Packaging
Around the World
50 Association News
52 International Diary
Micro-section of a solder void
showing excellent wetting angles,
from “Resolution of solder voids
in pin-in-hole product,” page 20.
www.globalsmt.net Global SMT & Packaging – February 2009 – 1
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