www.globalsmt.net
Global SMT & P
ackaging V
olume 9 Number 2
The Global Assembly Journal for SMT and Volume 9 Number 2 February 2009
Advanced Packaging Professionals
ISSN 1474 - 0893
Michael Maslana
STRAIN GAGE TESTING: THE DELTA EFFECT OF
THERMAL CYCLE TESTING
Interview Inside
RESOLUTION OF SOLDER VOIDS IN PIN-IN-HOLE
NEW PRODUCTS
PRODUCT
Februar
INDUSTRY NEWS
A NEW ANGLE ON PRINTING
y 2009 INTERNATIONAL DIARY
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